Industry Directory | Manufacturer
SAFE-PCB Group is a global leading provider of time-critical and technologically complex PCBs, attractive for small and medium volume quick-turn orders. We provide 2-hour images for validation, same day production, and wide range.
New Equipment | Test Equipment
Military-style laboratory services to validate bare boards for product assurance. Testing for delamination, voids, copper thickness, hole quality, proper stack-up, etc. Customer receives all cross-section pucks, boards and laboratory report with reco
MLT provides microvia laser drilling services for both rigid and flexible circuit board manufacturers. MLT is a leader in HDI drilling and design consulting to minimize drilling costs. All IPC high density microvia types are supported in most any s
Industry News | 2003-09-11 16:50:12.0
The printed circuit board industry is an ever-changing marketplace. The technologies of today certainly aren�t standing still, and neither should today�s PCB designer
Industry News | 2024-04-29 08:34:13.0
At IPC APEX EXPO 2024 in Anaheim, Calif., five competitors squared off to determine who was the best of the best at PCB design.
Technical Library | 2012-09-20 21:45:38.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturin
Events Calendar | Mon Jul 10 18:30:00 UTC 2023 - Mon Jul 10 18:30:00 UTC 2023 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Events Calendar | Tue Sep 10 18:30:00 UTC 2024 - Tue Sep 10 18:30:00 UTC 2024 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Multilayer PCB Stackup Planning Multilayer PCB Stackup Planning Planning the multilayer PCB stackup configuration is one of the most important aspects in achieving the best possible performance of a product. A correctly stacked PCB substrate can
Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need
