Electronics Forum: ipc 7905 ray prasad (6)

solder strength

Electronics Forum | Fri Sep 02 08:16:14 EDT 2005 | pjc

From Ray P. Prasad's article in this month's SMT magazine about the new IPC-7095 revison: ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some

Re: Used Wave Soldering Equipment

Electronics Forum | Thu Jun 25 14:32:14 EDT 1998 | Alon

| | | | Is anyone aware of any papers/publications dealing with the topic of selective soldering of through-hole parts on SMT pcb's..? | | | I would also be interested in a good reference book dealing with wave soldering. | | | Contact me if you hav

Industry News: ipc 7905 ray prasad (20)

IPC Inducts Two Long-Time Volunteers into Hall of Fame Ray Prasad and Lionel Fullwood Join Illustrious Rank

Industry News | 2013-02-19 18:26:34.0

In recognition of their extraordinary contributions to IPC and the electronic interconnect industry, Ray Prasad, Ray Prasad Consultancy Group and Lionel Fullwood, WKK Distribution Ltd., were honored with the IPC Raymond E. Pritchard Hall of Fame Award.

Association Connecting Electronics Industries (IPC)

IPC APEX India Educational Workshops to Address Design, Assembly and Process Challenges in Electronics Manufacturing

Industry News | 2013-07-24 16:39:34.0

IPC — Association Connecting Electronics Industries® announces that IPC APEX India™ will offer a comprehensive program of both half- and full-day workshops designed to help engineers find solutions to their most pressing concerns in electronics manufacturing.

Association Connecting Electronics Industries (IPC)

Events Calendar: ipc 7905 ray prasad (1)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Resumes: ipc 7905 ray prasad (1)

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

Express Newsletter: ipc 7905 ray prasad (924)

Partner Websites: ipc 7905 ray prasad (11)

Professional Development Courses | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm

! Ray Prasad, Ray Prasad Consultancy Group Sunday, September 22 | 8:30am — 12:00pm This course is based on IPC 7530 Guidelines for Temperature Profiling for Mass Soldering Processes chaired by Ray Prasad

Surface Mount Technology Association (SMTA)

i-Connect007’s RealTime with… (An Interview with Leo Lambert)

| https://www.eptac.com/blog/i-connect007s-realtime-with-an-interview-with-leo-lambert

… (An Interview with Leo Lambert) Posted on 3st April, 2014 by Leo Lambert Leo Lambert sits down long time friend and guest host Ray Prasad for i-Connect007’s RealTime with


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Association Connecting Electronics Industries (IPC)
Association Connecting Electronics Industries (IPC)

IPC is the trade association for the printed wiring board and electronics assembly industries.

Training Provider / Events Organizer / Association / Non-Profit

3000 Lakeside Drive, 309 S
Bannockburn, IL USA

Phone: 847-615-7100

consignment program

High Throughput Reflow Oven


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