Industry Directory | Training Provider / Events Organizer / Association / Non-Profit
IPC is the trade association for the printed wiring board and electronics assembly industries.
Industry Directory | Manufacturer
Rommtech-3S is your partner for reliable and cost effective contract manufacturing!have more than 15 years experience in the production of electronic and electromechanical devices � security products, radiators; cash registers manufacturing; igniters
New Equipment | Education/Training
Bare Board Inspection Training This 3-day, lectured course utilizes the images in the IPC-A-600 document to provide visual accept/reject criteria examples for all three classes of bare board fabrication and inspection. The IPC-A-600, “The Acce
New Equipment | Education/Training
Bare Board Inspection Training This 3-day, lectured course utilizes the images in the IPC-A-600 document to provide visual accept/reject criteria examples for all three classes of bare board fabrication and inspection. The IPC-A-600, “The Acce
Electronics Forum | Mon Apr 13 18:18:31 EDT 2020 | wbrenner
Does any one have a general cost percent going from class 2 to class 3 for the same Assembly.. Or, general up charge percent when biding class 2 vs class 3?
Electronics Forum | Mon May 04 06:31:50 EDT 2020 | jandon
Are you capable of doing Class 3 products? Does the design, bare PCB board and assembly meet the requirements of Class 3?
Used SMT Equipment | Pick and Place/Feeders
SM421S is a special-shaped placement machine that further improves the Cost Performance based on the Platform of SM421 Function: Placement Speed: Chip 21K CPH(IPC9850)/QFP 5.5K CPH(IPC9850) Component range: Max. 0402 ~ □55mm (component height H
Used SMT Equipment | Pick and Place/Feeders
Samsung SM421S automatic multi-function placement machine Mounting speed -Chip 21K CPH (IPC9850) -QFP 6K CPH (IPC9850) Volume should be components -Max. 0402 ~ □55mm(Part height H=15mm) Placement accuracy -±50@μ+ 3σ/Chip -&pl
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Parts & Supplies | Pick and Place/Feeders
Name of equipment: Samsung SM421, Samsung SM421 mounter, used Samsung SM421 mounter The latest arrival of Samsung SM421 mounter 18, 12-year machine, color state is excellent, welcome to buy! ! ! Brief introduction of equipment Samsung SM421
Parts & Supplies | Pick and Place/Feeders
Long board SMT Placement Machine JX-350 Chip 32,000CPH chip (Laser centering/Optimum) 21,000CPH chip (Laser centering / IPC9850) ■ From 0603 to □33.5mmsquare components ■ JUKI laser centering for high spe
Technical Library | 2016-07-28 17:00:20.0
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.
Technical Library | 2017-10-12 15:45:25.0
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Events Calendar | Wed May 04 00:00:00 EDT 2022 - Wed May 04 00:00:00 EDT 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
Events Calendar | Wed Jul 26 00:00:00 EDT 2017 - Wed Jul 26 00:00:00 EDT 2017 | Chicago, Illinois USA
IPC Technical Education - Best Practices in Design
Career Center | Wylie, Texas USA | Engineering,Production,Quality Control
Candidate needed for source inspection to the requirements of Mil-P-55110 IPC 6011, class 1,2 and 3 IPC 6012, class 1,2 and 3, PWB-PWG, Exp. with PWA and soldering necessary.
Career Center | Warminster, Pennsylvania USA | Quality Control
Inspects electronic systems, assemblies, subassemblies, components, and parts for conformance to specifications and identify/implement corrective actions among production and other staff. The Inspector should have some experience with board Inspe
Career Center | Stouffville, Ontario Canada | Engineering,Maintenance,Production,Quality Control,Technical Support
A versatile Facility, Manufacturing and Program Manager with over 18 years of progressive experience in the Electronic Manufacturing Service complimenting the needs of OEM/ECMs in the Automotive, Consumer and Commercial electronics and Datacom and Te
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMTnet Express, July 28, 2016, Subscribers: 25,879, Companies: 14,883, Users: 40,795 Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware Mike Bixenman, DBA - Kyzen Corporation | Ryan Hulse, PHD - Honeywell
SMTnet Express, June 8, 2017, Subscribers: 30,461, Companies: 10,609, Users: 23,346 Low-Cost Inkjet Printing Technology for the Rapid Prototyping of Transducers Bruno Ando, Salvatore Baglio, Vincenzo Marletta, Antonio Pistorio; DIEEI
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc-class-3-footprints-land-patterns_topic944_post3547.html
IPC CLASS 3 Footprints / Land Patterns - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns > Altium New Posts FAQ Search Events Register Login IPC CLASS 3 Footprints / Land Patterns
Imagineering, Inc. | https://www.pcbnet.com/blog/class-ii-vs-class-iii-inspection-standards-in-pcb-assembly/
It’s not uncommon to get questions about the different IPC class assembly inspection standards when it comes to PCB assembly . Most often, the first question is regarding the difference between the assembly processes of IPC Class 2 and Class 3
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
