Electronics Forum | Mon Mar 24 10:38:33 EDT 2008 | davef
No standard, but common practice is: IPC-TM-650 Test Methods Manual * Method 2.1.1, Microsectioning, Manual Method * Method 2.1.1.2, Microsectioning, Semi or Automatic Technique
Electronics Forum | Sat Jun 23 07:34:26 EDT 2007 | davef
This sounds like a form of corrosion called electromigration. It creates cathode anodic filaments. They have a fern like shape because it is a metallic based crystal structure. Electromigration requires: * Difference of electrical potential * Chemica
Industry News | 2016-03-22 16:48:06.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the Las Vegas Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Industry News | 2017-02-16 19:40:34.0
In recognition of his extraordinary contributions to IPC and the electronics industry, Doug Pauls, principal materials and process engineer, Rockwell Collins, was honored with the IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO® on Tuesday, February 14 at the San Diego Convention Center, the IPC Hall of Fame Award represents IPC's highest level of volunteer recognition.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Huntsville Chapter Technical Meeting: Evaluating Conformal Coatings
SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
/atmosphere), preform thickness, flux %, test vehicle, metallization and surface cleanliness – among potential others. The initial DOE is summarized in Table 1. Table 1: Description of input and control variables in initial DOE B. Test Method and Materials All
IPC is the trade association for the printed wiring board and electronics assembly industries.
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