Electronics Forum | Sat Jun 23 07:34:26 EDT 2007 | davef
This sounds like a form of corrosion called electromigration. It creates cathode anodic filaments. They have a fern like shape because it is a metallic based crystal structure. Electromigration requires: * Difference of electrical potential * Chemica
Electronics Forum | Wed Jun 30 18:12:59 EDT 2004 | crios
Thanks for the information. davef, I will search for and review the Ion Chromatography for Ionic Cleanliness test method. This definitely is the test I want to perform. Do you know what the IPC specification is using this test method? The outside
Industry News | 2017-02-16 19:40:34.0
In recognition of his extraordinary contributions to IPC and the electronics industry, Doug Pauls, principal materials and process engineer, Rockwell Collins, was honored with the IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO® on Tuesday, February 14 at the San Diego Convention Center, the IPC Hall of Fame Award represents IPC's highest level of volunteer recognition.
Industry News | 2013-09-26 18:03:10.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, March 25–27, 2014 at the Mandalay Bay Convention Center, Las Vegas, Nevada.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Huntsville Chapter Technical Meeting: Evaluating Conformal Coatings
SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
/atmosphere), preform thickness, flux %, test vehicle, metallization and surface cleanliness – among potential others. The initial DOE is summarized in Table 1. Table 1: Description of input and control variables in initial DOE B. Test Method and Materials All
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