Industry Directory | Manufacturer
Caring Circuit specialises in the supply of prototype, small and medium-series PCBs factory in Shenzhen,China.We are a leading provider of custom Single layer,double layer,multilayer rigid PCBs.
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Fabrication Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board
Electronics Forum | Fri Sep 21 10:35:37 EDT 2012 | davef
Flash gold is just thin electrolytic gold plating over electroless nickel or electrolytic nickel. Flash gold plating ... * Less than 3 microinch thick will be porous and take solder poorly * Greater than 10 microinch thick will cause brittle solder c
Electronics Forum | Mon Sep 24 10:07:46 EDT 2012 | eezday
The answer, as stated above, is 3 microinch's however, it is equaly important, if not more important, to understand that the only function of the gold is to protect the surfaces beneath it. Only enough gold to cover the nickel beneath it should be u
Industry News | 2018-10-18 09:33:23.0
wave soldering has become the future direction of development
Industry News | 2018-10-18 09:06:41.0
Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors
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Parts & Supplies | Pick and Place/Feeders
Siemens SIEMENS SIPLAC X 8mm FEEDER Specs: Siemens SIEMENS SIPLACE X 2x8mm FEEDER Specs: Siemens SIEMENS SIPLACE 44mm FEEDER 00 Specs: Siemens SIEMENS SIPLACE 24,32mm FEEDER Specs: Siemens SIEMENS SIPLACE 12/16mm FEEDER Specs: Siemens SIEM
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Parts & Supplies | Pick and Place/Feeders
Siemens SIEMENS SIPLACE 3x8mm SL FEEDE Specs: Supply&repair below DEK part: SIEMENS Model Part Number SIEMENS SIPLACE X 8MM FEEDER SINGLE PITCH 00141270 00141290 SIEMENS SIPLACE X 8MM FEEDER DOUBLE PITCH 00141269 00141289 SIEMENS SI
Technical Library | 2012-10-11 19:50:09.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper shows the benefits by using a pure palladium Layer in the ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) and ENEP (Electroless Nickel, Electroless P
Technical Library | 2012-12-13 21:20:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) surface finish. We used lead-free solder of Sn-1.2Ag-0.5Cu-Ni (LF35). We found multiple micro-voids of less than 10 µm line up within or above the intermetallic compound (IMC) layer. The number of micro-voids increased with the palladium (Pd) layer thickness. Our results revealed that the micro-void formation should be related to (Pd, Ni)Sn4 phase resulted from thick Pd layer. We propose that micro-voids may form due to either entrapping of volatile gas by (Pd, Ni)Sn4 or creeping of (Pd, Ni)Sn4.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | Cable and Wire Harness Assembly Training Courses
Browse training and certification programs for wire harness cable and connector assembly.
Career Center | Gurgaon, India | Engineering,Management,Production,Purchasing,Quality Control
1. Quality Function Management • Ensure timely inspection at incoming, in-process & outgoing stage. • Non-conformance review & reporting. • Decision making - Right disposal of Non-conforming material. • Determination of Vendor Quality rating (VQR
-free soldering, established trends of increasing function
Blackfox Training Institute, LLC | https://www.blackfox.com/3-things-you-should-know-about-lead-free-soldering/
3 Things You Should Know About Lead-Free Soldering - Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
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. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
IPC is the trade association for the printed wiring board and electronics assembly industries.
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