Electronics Forum | Wed Aug 04 16:37:56 EDT 1999 | Doug
| Hello Netters, | | Can anyone provide me with info or where to get info on acceptability of solder beads and solder balls? | | Thanks for any help | | Tom B. | | Tom, The IPC sets the standards for acceptability. But in a nutshell if the ball i
Electronics Forum | Thu Aug 05 04:51:46 EDT 1999 | Wolfgang Busko
| | Hello Netters, | | | | Can anyone provide me with info or where to get info on acceptability of solder beads and solder balls? | | | | Thanks for any help | | | | Tom B. | | | | Tom, | The IPC sets the standards for acceptability. But in a nu
Industry News | 2010-09-30 00:35:51.0
The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.
Industry News | 2016-01-17 19:26:58.0
In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.
This video outlines the IPC-A-620 certification and training program and wires and terminals. It describes the program, the materials and provides a good general overview of the class outline. Visit Our Site For More Information About IPC IPC WHMA-A
Training Courses | | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 Now Available: Amendments for J-STD-001F and IPC-A-610F In order to keep up with industry demand, IPC has released
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/wire-pull?con=t&page=4
. The standards contain specifications for acceptance or rejection criteria. Small geometry (Ultra Fine Pitch) applications are becoming more and more popular and as such Nordson DAGE offers wire pulling test equipment optimized specifically for this function
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
correlation between solder joint void size/location and solder joint thermal cycle integrity existed for the thermal cycle range of -55°C to +125°C; (2) derive a BGA/CSP solder joint void criteria for submission to the IPC-JSTD- 001 committee. PROCEDURES Test
IPC is the trade association for the printed wiring board and electronics assembly industries.
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