Industry Directory | Manufacturer
www.dgtronik.com.pl www.dgtronik.co.uk Contract electronic manufacturing. High mix - low/midium volumes, EMS, SMT, THT, testing, PCB, components, realization time 1-3 weeks, IPC-610-D, ISO9001:2008.
New Equipment | Assembly Services
Rest assured in the quality of your production runs with Accu-sembly's IPC-610D certified hand solderers and inspectors, and electrostatic discharge (ESD) protected assembly floor. Our Thru-hole assembly process allows for your parts to be hand prepp
PCBA(RoHS-Compliance,Lead free,ODM,OEM,SMT,EMS) We supply OEM and ODM services for PCBA. 1) Surface-mounting Technology (SMT) and Through-hole/DIP 2) 0402,0201 placement 3) BGA,CSP,QFP 4) IC precision: 0.3mm 5) AOI,X-Ray,ICT(In circuit test),FC
Electronics Forum | Fri Aug 28 05:26:05 EDT 2009 | sachu_70
Hi Dave, Would this be different from IPC-610-D. I am not sure.
Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT
I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT
Career Center | Montrose, California USA | Management,Production,Quality Control
Micro/sys designs and manufactures embedded board level products. We currently have an exciting opportunity for an experienced SMT manufacturing professional. We are looking for an energized individual to take a leadership position managing our prod
Career Center | Bangalore, Indiana India | Production,Quality Control
Line audits 5’s line audits RoHS line audits Screen printing machine operating S.M.T M/c Operator “Siemens” HS-60, S-27, F5HM. S.M.T Fuji, cp6, ip3, xp143 & 243 M/c Technician. Awareness of reflow profiling and verification Servicing of mobile sets a
Career Center | Villupuram, India | Production
BE in ECE, Working in one of the EMS industry (V NET TECHNOLOGY PVT LTD) in Pondicherry. Above 4 years of experience in SMT & PTH Process Cum Production line. Keyskills Process control, Planning, Manpower, 5S, Kaizan, FMEA, Six sigma, OEE
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
Joints,” Proceedings of SMTAI 2006, 406-415, Chicago, IL, September 2006. [4] IPC-A-610D, “Acceptability of Electronics Assemblies,” Section 8.2.12.4, 8-83, IPC, February 2005. [5] IPC-7095B, “Design and Assembly Process Implementation for BGAs,” Section
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. Another constraint is to ensure that all IPC 610D solder joint inspection criteria are met (some papers have been written that suggest that hole fill requirements could be reduced while still maintaining sufficient reliability [11
