New Equipment | Education/Training
This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the
Rapid Turnaround X-Ray Inspection Services Glenbrook Technologies offers X-ray inspection services for quality control, failure analysis, product development and metrology. Inspection of electronic assemblies including BGAs, and multi-layer PC
Electronics Forum | Tue Dec 05 10:35:39 EST 2000 | Gil Zweig
See IPC-7095, "Design and Assembly Process Implementation for BGAs"
Electronics Forum | Wed Feb 02 19:45:09 EST 2005 | ybt
try refering IPC-7095 Design and Assembly Process Implementatin for BGAs. I hope it helps.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2003-05-12 08:52:56.0
September 21-25, Donald Stephens Convention Center, Rosemont, IL
Technical Library | 2019-10-16 23:18:15.0
Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Flexible City and State, California USA | Technical Support
Position: Field Service Engineer to support Automated X-Ray Inspection (AXI) Equipment for Manufacturing. Responsibilities include, but not limited to: PRIMARY RESPONSIBILITIES: - Provide Hardware Technical support to existing customers; Hard
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/products/x-ray-inspection-systems/explorer-one
®-Detektor sorgt für eine einfache Navigation durch Proben und die schnelle Identifizierung von Fehlern. Einfache Sicherstellung der IPC-A-610- und IPC-7095
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_20_09.pdf
5-23 Solderability Subcommittee 5-24 Assembly & Joining Subcommittee 5-25 Opto-Electronics Assembly Subcommittee 6 List of Documents Controlled by 5-20 Committee IPC-7095 J-STD-032 J-STD-013 5-21f IPC-75255-21e IPC-9503 now J-STD-075 under B-10a IPC-9501, 2, 4 5-21c
