Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
Industry Directory | Manufacturer
Power Designers Sibex is located in Florida with a combined manufacturing area of 125K square feet. Quality: ISO9001:2008, ISO13485 Medical, UL Approval and ITAR registered. Military, Medical, Commercial
New Equipment | Education/Training
This 3-day, lectured course utilizes the images in the IPC-A-610 inspection document to provide visual accept/reject criteria examples for all three classes of assembly production–in both lead and lead-free. The IPC-A-610, “The Acceptabil
New Equipment | Education/Training
Component Rework/Board Repair Training This is a 5-day, advanced course for anyone responsible for quality and reliability of reworked or repaired electronic assemblies. It is a comprehensive hands-on training program with 80% lab work. Attendees m
Electronics Forum | Mon May 04 06:31:50 EDT 2020 | jandon
Are you capable of doing Class 3 products? Does the design, bare PCB board and assembly meet the requirements of Class 3?
Electronics Forum | Tue May 27 16:42:01 EDT 2003 | markhoch
I've been tasked with finding out how difficult it would be to convert our company from a Class 2 to a Class 3 supplier. Does anybody know if there is a "how to" manual available to assist me in getting this done. Short of going thru all of IPC-A-610
Used SMT Equipment | In-Circuit Testers
The Aeroflex/IFR/Marconi 2968 TETRA Radio Test Set Version 3.2, is designed to provide faster, more comprehensive and easier to use tests for the routine terminal maintenance and repair operations normally undertaken by the emergency services and man
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Used SMT Equipment | Pick and Place/Feeders
Make: JUKI Model: JUKI FX-3RL Details:1.High-speed Mounting: Equipped with 4 mounting heads × 4 arm axes × 2 mounting stations, achieving single chip mounting speed of 0.049 seconds per chip (74,000 CPH / IPC9850: 60,000 CPH) .2.Modular Design: Bas
Industry News | 2012-09-13 09:35:40.0
GPD Global will exhibit in Booth #435 at the upcoming SMTA International Conference and Expo,
Industry News | 2012-06-11 12:24:54.0
GPD Global announces that it will exhibit in Booth #6085 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
Parts & Supplies | SMT Equipment
Panasert ai parts 1.Product name: CUTTER6318828 2.Original: China 3.Model No.:6318827 4.Brand Name: panasert This company specialized production, PANASERT(AJ.AVB.AVF.AVG.AV.AVK.AVK2 RT.JV.JVK.JVK3.RH.RH3.RH6.RHS .RHS2B .RG131.RL131).UNI
Parts & Supplies | SMT Equipment
Panasert ai parts 1.Product name: pipe6323008 2.Original: China 3.Model No.:6323008 4.Brand Name: panasert This company specialized production, PANASERT(AJ.AVB.AVF.AVG.AV.AVK.AVK2 RT.JV.JVK.JVK3.RH.RH3.RH6.RHS .RHS2B .RG131.RL131).UNIVE
Technical Library | 2016-07-28 17:00:20.0
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | IPC-A-610 Trainer (CIT) Recert.
The Certified IPC-A-610 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-A-610 Specialist (CIS) training.
Training Courses | | | IPC-A-610 Specialist (CIS) Recert.
The Certified IPC-A-610 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-A-610 Specialists.
Career Center | Warminster, Pennsylvania USA | Quality Control
Inspects electronic systems, assemblies, subassemblies, components, and parts for conformance to specifications and identify/implement corrective actions among production and other staff. The Inspector should have some experience with board Inspe
Career Center | Warminster, Pennsylvania USA | Production,Quality Control
PCB component level assembly - soldering under microscope. *Soldering and mechanical assembly using excellent solder skills, manual dexterity, depth perception and attention to detail. *Perform or inspect component replacement and rework on units.
Career Center | Stouffville, Ontario Canada | Engineering,Maintenance,Production,Quality Control,Technical Support
A versatile Facility, Manufacturing and Program Manager with over 18 years of progressive experience in the Electronic Manufacturing Service complimenting the needs of OEM/ECMs in the Automotive, Consumer and Commercial electronics and Datacom and Te
Career Center | , California | Quality Control
Tammy T Vo P.O. Box 2213 (714) 254-5073 E-mail: nhutamvo@yahoo.com Position of Interest Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications 12 years of experience wo
SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 Now Available: Amendments for J-STD-001F and IPC-A-610F In order to keep up with industry demand, IPC has released
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-services/class-3-facility/
IPC Class 3 Facility Training - Blackfox Institute Skip to content Phone: (888) 837-9959 | sharonm@blackfox.com Store | Home | EN ES Search for: Course Calendar Course Calendar 2023 IPC Certification Online IPC Training IPC Instructor Online IPC Training IPC A-610 CIT IPC A-610 CIT Recertification IPC J-STD-001 CIT IPC J-STD-001 CIT
| https://www.eptac.com/ask/smt-terminal-style-components-acceptability-for-class-3-j-std-001-and-or-ipc-a-610/
SMT Terminal Style Components Acceptability for Class 3 (J-STD-001 and or IPC-A-610) - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
