SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few
SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints
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Louis Lin from Nordson DAGE to Present at IPC Southeast Asia High Reliability Conference 2014-08-19 Get practical methodologies that can be deployed today to enhance your operations Nordson DAGE, a
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
]. Because a finished electronic assembly can be rejected based on the IPC guidelines for macro or process voiding defects [4, 5], it is desirable to eliminate voiding, or least reduce the void density substantially
