Electronics Forum | Thu May 11 11:25:56 EDT 2017 | davef
Key to Rosin Fluxes [from SUPERIOR FLUX & MFG. CO.] Type R (Rosin): Non-activated rosin flux for soldering copper. Residues are non-corrosive and non-conductive. Type RMA (Rosin Mildly Activated): Mildly activated rosin flux that contains no chlori
Electronics Forum | Mon Dec 20 10:20:14 EST 2010 | 18424
Test Resistance to ECM shall be 65C +- 2C @ 88.5% +- 3.5% All SIR Measurements shall not exceed 100 MOhm. I am not sure of voltage.
Industry News | 2016-04-22 10:20:35.0
Kester is proud to announce the launch of SELECT-10™Selective Solder Flux, a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process. As part of Kester’s portfolio of high reliability products, SELECT-10™ has passed IPC SIR testing as a raw and partially activated flux. Sustained activity within the flux allows for good barrel fill in challenging and high temperature applications. Specific to selective soldering, SELECT-10™ does not spread beyond the spray pattern and will not clog nozzles. SELECT-10™ is classified as ROL0 flux under IPC J-STD-004B.
Industry News | 2009-03-06 16:06:08.0
ITASCA, IL � March 2009 � Kester is proud to announce that David Scheiner will hold a Solder Alloy Task Group at the upcoming APEX Conference and Exhibition, during Session 5-24c of the Standards Development Meetings, scheduled to take place on Monday, March 30, from 1:30-3 p.m.
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
| https://www.eptac.com/blog/j-std-001es-space-addendum-requirements-for-ipc-certification
J-STD-001ES Space Addendum Requirements for IPC Certification Looking for solder training standards, manuals, kits, and more? Visit
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
IPC-J-STD-001 Chip Component Solder Joints - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login IPC-J-STD-001 Chip Component Solder Joints
