STI offers a variety of electrical test services from component-level testing/characterization to system-level testing. Electrical testing is offered to validate values in accordance with component manufacturer's performance specifications, a custom
New Equipment | Test Equipment
Fast and accurate ionic contamination cleanliness testing. Dynamic testing of ionic contamination is a widely approved and followed standard. So, too, is the equipment that makes it possible - SCS Ionograph®. Available in different models, the SCS
Electronics Forum | Tue Jan 10 22:10:58 EST 2006 | davef
Muse We don't believe that the IPC TM-650 Test Methods Manual, 2.4.1E, Adhesion, Tape Testing--5/04 [ http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2.4.1E.pdf ] that you refer to is a "black pad" test. We think it's a method for testing the a
Electronics Forum | Mon Mar 04 15:29:47 EST 2002 | genny
IPC-TM-650 is free downloadable test methods defined by IPC. Check their website. http://www.ipc.org, and look for the free downloads section. The manual is divided into several subcategories, and I believe under mechanical test methods there are
Industry News | 2016-09-29 20:30:17.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on September 26 at IPC's Fall Standards Development Committee Meetings in Rosemont, Ill. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
Technical Library | 2018-08-15 17:27:28.0
Smartphones and tablets require very high flexibility and severe bending performance ability of the flexible printed circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs, the extraordinary highly flexible, treated rolled-annealed (RA) copper foils have recently used instead of regular RA foil and electro deposited foils. It is very important to measure the Young's moduli of these foils predicting the mechanical properties of FPCs such as capabilities of fatigue endurance, folding, and so on. Even though the manufacturers use IPC TM-650 2.4.18.3 test method for measuring Young's modulus of copper foils over many years, where Young's modulus is calculated from the stress–strain (S–S) curve, it is quite difficult to obtain the accurate Young's modulus of metal foils by this test method.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ZESTRON proudly offers SIR testing at our Manassas, VA location. SIR is a quantitative test method used to characterize the PCB manufacturing process residues and their impact on reliability. ZESTRON’s SIR testing capability is offered to clients who
SMTnet Express, July 13, 2017, Subscribers: 30,584, Companies: 10,624, Users: 23,496 Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements K. Tellefsen, M. Holtzer, T. Cucu, M. Liberatore, M. Schmidt - Alpha
SMTnet Express, August 16, 2018, Subscribers: 31,259, Companies: 11,015, Users: 25,092 Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method Kazuki Kammuri, Atsushi Miki, Hiroki Takeuchi; JX
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/cleanliness-test_topic1738_post7101.html
PCBA Cleanliness test process? For Ionic Residues on PCBA, there are three methods of testing in IPC-TM-650: Dynamic Extraction Methods, Static Extraction Methods and manual method
| https://www.eptac.com/faqs/ask-helena-leo/ask/copper-elongation-and-tensile-strength-requirements
? For example, military standard MIL-PRF-31032 states copper elongation shall... Question: IPC-TM-650, 2.4.18.1 is the method for testing in-house plating for tensile strength and elongation, but where can I find the IPC requirements for results
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