1074 is ops finish better for rework process results

Method for Automated Nondestructive Analysis of Flip Chip Underfill

Method for Automated Nondestructive Analysis of Flip Chip Underfill

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

. For instance, what is the impact of reworking a SAC305/405 assembled connector using an alternate Pb-free alloy? Is changing the Pb-free alloy used within the primary attach process to match the PTH rework alloy the right solution

Surface Mount Technology Association (SMTA)

.  For chip components, SAC paste assembly of Sn/Pb component on OSP boards is recommended for better reliability and longer life. 17 Experiment #2 Evaluation Parameters

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