1097 is ops finish good for rework process results

Method for Automated Nondestructive Analysis of Flip Chip Underfill

Method for Automated Nondestructive Analysis of Flip Chip Underfill

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

. For instance, what is the impact of reworking a SAC305/405 assembled connector using an alternate Pb-free alloy? Is changing the Pb-free alloy used within the primary attach process to match the PTH rework alloy the right solution

Surface Mount Technology Association (SMTA)

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print

with lead-free alternatives.    Pb Usage in the Semiconductor Industry   In the semiconductor industry, lead (Pb) is primarily used in a process known as lead finish