Electronics Forum | Thu Jan 06 08:03:47 EST 2005 | davef
On solder in vias: It looks like the via are not solder masked well and pick-up solder either: * Solder coating ... OR * During leveling It's possible that the design specifies openings in the solder mask for these via. On solder in the unsupporte
Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve
Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men
Industry News | 2017-04-03 15:02:09.0
MIRTEC today announced they are participating in the upcoming What's New in Electronics Live! event. They will exhibit in booth #8. They will exhibit in booth #327. The show is scheduled for May 9-10 and will take place at the National Exhibition Center in Birmingham, UK.
Industry News | 2023-03-27 13:03:23.0
SMTA Europe is proud to announce the 2023 Electronics in Harsh Environments Conference, taking place May 23-25 in Amsterdam, Netherlands. This global conference is a three-day technical event focused on building reliable electronics used in power electronics and harsh environments.
This video describes what the IPC-J-STD-001 training program and the document for assembling printed circuit boards. In this video BEST Inc describes the assembly standard and what it entails . It also describes what the training program is. Operato
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
SMTnet Express, July 18, 2019, Subscribers: 32,162, Companies: 10,836, Users: 24,951 Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution Credits: MacDermid Inc. The increased demand for electronic devices in recent years
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
) European Union Directive has significantly reduced the use of tin/lead surface finishes for component terminations. A reexamination of solder joint wetting of lead-free solders with the new component terminations is key to establishing thermal process profiles that ensure acceptable solder joint integrity
| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue
? Posted on 5st June, 2012 by Mark Pilkington Well I’ve got to say it again, what is wrong with the existence of voids in solder joints
