Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Industry News | 2012-09-13 06:59:37.0
ASM Assembly Systemsexperiences rising demand for custom-designed nozzles, grippers and feeders.
SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea Return to Previous Page Over the past
SMT Express, Volume 2, Issue No. 6 - from SMTnet.com Volume 2, Issue No. 6 Wednesday, June 14, 2000 Featured Article Return to Front Page Process Control for Solder Flux Stacy KaliszMark OwenMVTechnology Ltd. ABSTRACT Flux used in ball grid
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: SMT Reflow Oven Machine Model: SMT Reflow Oven Brief: ETA Draco Draco733 lead-free reflow oven with 10 heating zones and 3 cooling zones ETA Draco 733 reflow oven improve production efficiency, and use important imported brands for important parts
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FLOware-Import-Export-Data-Reference-Guide-22100024R-v2-9-3P.pdf
. Page 2 Add “position [angle] is counterclockwise.” Page 13 Change “fiducial” to “badmark” in definition for BdmkUsed. Modify definition for AlignUsed. BOARD Remove “future versions will allow MOUNT selection or rejection of lines...” from FeatureID
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