Service and support of Vitronics Soltec US factory made reflow ovens. 20+ years of experience supporting these products as a former employee.
The DriSteem Adiatec ultrasonic humidifier provides evaporative cooling and humidification in room or in AHU/duct for application flexibility. Ultrasonic units humidify using high frequency oscillation of piezoelectric transducers, causing mist to de
The DriSteem Adiatec ultrasonic humidifier provides evaporative cooling and humidification in room or in AHU/duct for application flexibility. Ultrasonic units humidify using high frequency oscillation of piezoelectric transducers, causing mist to de
Electronics Forum | Thu Aug 24 17:08:58 EDT 2000 | Dr. Ning-Cheng Lee
Depending on the stress condition experienced by the solder joints. For joints under a greater stress, the time to reach equilibrium can be shorter. Of course, the change is also more significant in phase structure. For low stress conditions, it may
Used SMT Equipment | Soldering - Reflow
Vitronics Isotherm 500S 1997 Surface Mount Technology Equipment reflow oven Easy Set-up and operation Five (5) top heat zones w/ mesh belt/ edge rail conveyor, 12” process length, 64” heated tunnel length, 12” x 20” max PCB board size PC and monitor
Used SMT Equipment | Soldering - Reflow
Vitronics Isotherm 500S 1997 Surface Mount Technology Equipment reflow oven Easy Set-up and operation Five (5) top heat zones w/ mesh belt/ edge rail conveyor, 12” process length, 64” heated tunnel length, 12” x 20” max PCB board size PC and monito
Industry News | 2012-02-07 16:20:22.0
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present the paper titled “Effect of Cooling Rate on the Intermetallic Layer in Solder Joints” at the upcoming IPC APEX Expo.
Industry News | 2014-06-12 18:40:43.0
The new Electrovert® Electra™ by Speedline Technologies® is the "Next Generation" in wave soldering systems, offering innovative new features and enhanced performance that make it the most ‘state-of-the-art’ wave soldering system to be launched into the marketplace to date, according to Geoff Klein, Electrovert's General Manager.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2019-04-17 21:29:14.0
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.
SMTnet Express August 29, 2013, Subscribers: 26233, Members: Companies: 13474, Users: 35110 Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging by Mike Powers, Jianbiao Pan, Julie Silk, Patrick
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
temperatures under this test (isothermal system). In real-world applications, however, the temperature experienced by the package may be significantly higher than that of the board because of the heat contributed by the operating device's junction temperature
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20060405647
., Auburn University Milo Degradation Of Leadfree Solder Materials Subjected To Isothermal Aging With Use Of Cabga208 Package Christy Evans, Auburn University 1:15PM - 1
