New SMT Equipment: j-std-001 damage to solder pad landing (9)

PCB Epoxy Repair Kit

PCB Epoxy Repair Kit

New Equipment | Rework & Repair Equipment

The BEST PCB Epoxy Repair Kit can be used to repair lifted pads and traces as well as build up and repair edge corner damage to PCBs or repair solder mask which has been damaged or removed. By adding colorants a pcb color epoxy kit can be made up cus

BEST Inc.

Gold Contact Replating Kit

Gold Contact Replating Kit

New Equipment | Rework & Repair Equipment

The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m

BEST Inc.

Electronics Forum: j-std-001 damage to solder pad landing (21)

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Wed Apr 14 19:47:13 EDT 2021 | solderingpro

Sounds like you may have already found the issue: inconsistency from your supplier. Seeing as Gold really doesnt oxidize and you're using an inert environment (N2 I suspect), I would turn my attention to the supplier. You said yourself, the "Shine

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr

Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads

Industry News: j-std-001 damage to solder pad landing (36)

John Deere Electronic Solutions Becomes First OEM to Earn Certification as a Qualified Manufacturer to IPC J-STD-001 and IPC-A-610

Industry News | 2015-02-18 14:38:15.0

IPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to John Deere Electronic Solutions, a manufacturer of custom, integrated electronics components based in Fargo, N.D. The company became the first OEM to successfully complete an intensive audit based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.

Association Connecting Electronics Industries (IPC)

IPC Workshops Highlight Updates to Key Industry Standards: IPC-A-610, J-STD-001, and IPC-A-600 and IPC-6012

Industry News | 2010-04-19 12:56:32.0

BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.

Association Connecting Electronics Industries (IPC)

Technical Library: j-std-001 damage to solder pad landing (1)

How to choose printing squeegees and Pressure details affect printing solder paste result

Technical Library | 2022-07-11 09:24:48.0

The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil.

Shenzhen FS equipment CO.,LTD

Videos: j-std-001 damage to solder pad landing (9)

I.C.T | AOI Optical Inspection Machine For SMT Components and DIP Solder Joint

I.C.T | AOI Optical Inspection Machine For SMT Components and DIP Solder Joint

Videos

I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir

Dongguan Intercontinental Technology Co., Ltd.

This video is on the dry film pad repair technique per IPC 7721 standards. BEST professional instructors demonstrate the proper technique for the repair for PCB pads using the dry film.

This video is on the dry film pad repair technique per IPC 7721 standards. BEST professional instructors demonstrate the proper technique for the repair for PCB pads using the dry film.

Videos

This video is on the dry film pad repair technique per IPC 7721 standards. BEST professional instructors demonstrate the proper technique for the repair for PCB pads using the dry film. http://www.solder.net More on PCB pad repair here: http://www.s

BEST Inc.

Training Courses: j-std-001 damage to solder pad landing (2)

IPC-7711/7721 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-7711/7721 Specialist (CIS)

The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.

Justice Electronic Training Services

IPC-7711/7721 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-7711/7721 Trainer (CIT)

The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.

Justice Electronic Training Services

Events Calendar: j-std-001 damage to solder pad landing (2)

San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA

Events Calendar | Mon Jun 10 00:00:00 EDT 2024 - Mon Jun 10 00:00:00 EDT 2024 | Carlsbad, California USA

San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Express Newsletter: j-std-001 damage to solder pad landing (994)

SMTnet Express - January 14, 2016

SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 Now Available: Amendments for J-STD-001F and IPC-A-610F In order to keep up with industry demand, IPC has released

Reduced Oxide Soldering Activation (ROSA)

Reduced Oxide Soldering Activation (ROSA) News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Reduced Oxide Soldering Activation (ROSA) American Competitiveness Institute

Partner Websites: j-std-001 damage to solder pad landing (19)

PCB Libraries Forum : New 2016 Solder Joint Goals

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_new-2016-solder-joint-goals_topic1921.xml

. I don't have a copy of the IPC-J-STD-001 yet. Hope to have that soon. New 2016 Solder Joint Goals : There is a Pas Size Round-off

PCB Libraries, Inc.

Printed Circuit Board Repair Training - Blackfox Institute

Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/operator/printed-circuit-board-repair/

Printed Circuit Board Repair Training - Blackfox Institute Skip to content Phone: (888) 837-9959 | sharonm@blackfox.com Store | Home | EN ES Search for: Course Calendar Course Calendar 2023 IPC Certification Online IPC Training IPC Instructor Online IPC Training IPC A-610 CIT IPC A-610 CIT Recertification IPC J-STD-001 CIT IPC J-STD-001 CIT

Blackfox Training Institute, LLC


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