New Equipment | Test Equipment
MUST System III – Solderability test system (wetting balance) tests to IEC 60068-2-54 and 60068-2-69, MIL-STD-883 Method 2022, IPC/IEC J-STD003A, IPC/IEC/JEDEC J-STD-002B and EIA/JET-7401. Includes everything needed for all forms of solderability t
New Equipment | Test Equipment
“Dip & Look Test”— The Pulsar provides precise handling of electronic components for the automated process of a flux and solder dip of the component terminations. After the dip process, the operator inspects the terminatio
Electronics Forum | Thu Nov 19 13:49:00 EST 2009 | bricke
We have been manufacturing a part using bright electrolytic tin as the finish. Our customer has been hand soldering using 63/37. They have recently switched to SN96 and have been experiencing solderability issues. We have sent samples to an outside
Electronics Forum | Thu Nov 12 11:21:42 EST 2015 | davef
IPC J-STD-003. Solderability Tests for Printed Boards
Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
Industry News | 2003-04-17 11:35:44.0
Honored for their contributions to IPC and the electronics industry
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/efd/about-us/standards/ipc-j
. Zu den Verarbeitungsstandards der IPC-Richtlinien (The Institute for Interconnecting and Packaging Electronic Circuits) für die folgenden J-Standards, mit denen wir die Kundenzufriedenheit sicherstellen möchten, gehören: J-STD-003
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. The proper storage and handling procedures during PCB assembly are clearly defined in the joint IPC/JEDEC standard J-STD-033A Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow
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