New Equipment | Solder Materials
Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic
New Equipment | Solder Materials
To meet the increased demands imposed by the higher operating temperatures involved in successful lead free soldering, DKL Metals have released new flux products designed specifically for this environment. A selection of the most popular, incorporati
Electronics Forum | Fri Dec 03 04:20:18 EST 2010 | grahamcooper22
Hi In Dec 2008 the IPC J STD 004 was updated to 004B, and I am wondering what the new test conditions are for testing flux Surface Insulation Resistance and Electro Migration Potential within the new spec. I am looking for the recommended test temp
Electronics Forum | Wed Dec 29 12:27:39 EST 2010 | davef
Flux evaluation * J-STD-004, Requirements for Soldering Fluxes * IPC-A-610, Acceptability of Electronic Assemblies
Industry News | 2013-10-15 18:26:54.0
IPC – Association Connecting Electronics Industries® awarded the first IPC J-STD-004 Qualified Products Listing (QPL) certificate to Indium Corporation’s Clinton, N.Y., USA facility.
Industry News | 2022-05-18 12:46:50.0
Committee Awards presented at IPC SummerCom 2022
Technical Library | 2008-07-10 12:52:18.0
This paper reviews the J-STD-004 and how it is used in flux categorization and selection. It also discusses the major types of flux formulations available, and the design, process and reliability implications of using each type. The purpose of the paper is to help the reader make an informed choice when selecting wave solder fluxes for lead-free processing.
Technical Library | 2017-02-09 17:08:44.0
The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question.
HIGH QUALITY SOLDER PASTE Brand: Dyfenco Country of Origin: Taiwan Product Name: Haloge-Free & Lead-Free Solder Paste Product Code: QT459DE Price: (Contact us for best price) MOQ: 50kg Product Features: - Lead-Free - Halogen Free - No Clean
ALPHA® Telecore XL-825 lead-free cored solder wire minimizes spattering in hand soldering operations, thus reducing circuit board contamination and enhancing worker safety and comfort.
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Blackfox Training Institute, LLC | https://www.blackfox.com/ipc-certification/j-std-001-recert/
IPC J STD 001 Recertification by Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/jstd001-plated-throughhole-obstruction_topic2145_post9247.html
J-STD-001: Plated Through-hole Obstruction - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login J-STD-001: Plated Through-hole Obstruction
