New SMT Equipment: j-std-004b (2)

W20 Water Soluble Solder Paste

W20 Water Soluble Solder Paste

New Equipment | Solder Materials

AIM’s W20 water soluble solder paste is a zero halide/halogen flux formula. W20 has been engineered for enhanced wetting performance on all solderable electronic surfaces. W20 exhibits excellent print characteristics and 8+ hours of stencil life. W20

AIM Solder

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste

New Equipment | Solder Materials

8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr

Henkel Electronic Materials

Electronics Forum: j-std-004b (3)

"R" type solder paste

Electronics Forum | Thu May 11 11:25:56 EDT 2017 | davef

Key to Rosin Fluxes [from SUPERIOR FLUX & MFG. CO.] Type R (Rosin): Non-activated rosin flux for soldering copper. Residues are non-corrosive and non-conductive. Type RMA (Rosin Mildly Activated): Mildly activated rosin flux that contains no chlori

IPC J STD 004B Reliability tests

Electronics Forum | Mon Dec 20 10:20:14 EST 2010 | 18424

Test Resistance to ECM shall be 65C +- 2C @ 88.5% +- 3.5% All SIR Measurements shall not exceed 100 MOhm. I am not sure of voltage.

Industry News: j-std-004b (18)

Volunteers Honored for Contributions to IPC and Electronics Industry Fifty Awards Presented at IPC APEX EXPO�

Industry News | 2009-04-15 23:12:38.0

BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO 2009, held March 31�April 2 in Las Vegas.

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Contributions to Electronics Manufacturing Industry and IPC

Industry News | 2012-02-28 14:00:06.0

IPC presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

Technical Library: j-std-004b (2)

Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?

Technical Library | 2017-02-09 17:08:44.0

The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question.

Indium Corporation

Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements

Technical Library | 2017-07-13 16:16:27.0

Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.

Alpha Assembly Solutions

Express Newsletter: j-std-004b (3)

Partner Websites: j-std-004b (1485)

IPC J STD 001 Recertification by Blackfox

Blackfox Training Institute, LLC | https://www.blackfox.com/ipc-certification/j-std-001-recert/

IPC J STD 001 Recertification by Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001

Blackfox Training Institute, LLC

J-STD-001: Plated Through-hole Obstruction - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/jstd001-plated-throughhole-obstruction_topic2145_post9247.html

J-STD-001: Plated Through-hole Obstruction - PCB Libraries Forum   Forum Home > Libraries > Footprints / Land Patterns    New Posts    FAQ    Search    Events    Register    Login J-STD-001: Plated Through-hole Obstruction

PCB Libraries, Inc.


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