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Electronics Forum | Fri Jan 15 20:37:11 EST 1999 | jason
| | Jason, | | | | Have you looked at Manex software. I know they have a great reputation in the electronics industry since they developed their system around electronics specifically. | | | | Check out this article I found...this may help. Em
Electronics Forum | Wed Jul 21 12:41:39 EDT 1999 | jason
I have pcb's in which i am experiencing warping. the boards are 12.8125" on a diagonal measurement. they are out approximatley .010". the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,and what is the propper fo
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2003-05-21 09:03:19.0
Cadence Design and Analysis Solution Used for Asus's Ultra-high-frequency PCB Designs
Technical Library | 2014-06-05 16:44:07.0
Stencil printing capability is becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.(...) The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.
Technical Library | 2007-06-27 15:43:06.0
Traditionally most flip chips were designed with large bumps on a coarse pitch. However, as the trend towards smaller, more compact assemblies continues the sizes of semiconductor packages are forced to stay in line. New designs are incorporating smaller bump diameters on increasingly aggressive pitches, and in many cases decreasing the total IO count. With fewer and smaller bumps to distribute the load of the placement force it is becoming increasingly vital for equipment manufacturers to meet the challenge in offering low force placement solutions. One such solution will be presented in the following discussion. Also presented will be ways to minimize the initial impact spike that flip chips experience upon placement.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
Events Calendar | Wed Oct 20 00:00:00 EDT 2021 - Wed Oct 20 00:00:00 EDT 2021 | ,
Penang Chapter Virtual Vendor & Technical Day
SMT Express, Volume 3, Issue No. 1 - from SMTnet.com Volume 3, Issue No. 1 Friday, January 19, 2001 Special Announcements SMTnet's OnBoard Forum to Feature Jason Spera January 22, 2000 8:00 AM EST to January 26, 2000 5:00 PM EST Jason Spera
SMTnet Express, June 5, 2014, Subscribers: 22800, Members: Companies: 13884, Users: 36269 Stencil Printing Yield Improvements Mike Bixenman, Debbie Carboni, Jason Chan; Kyzen Stencil printing capability is becoming more important as the range
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/2019_ICEET_Program.pdf
Brightness LED Application Jie Geng, Ph.D., Indium Corporation Session 1: Solder Materials Chair: Jason Keeping, P.Eng., Celestica, Inc. Co-Chair: Jason Rogers, M.G. Chemicals REGISTRATION OPENS Seika Machinery, Inc
ORION Industries | http://orionindustries.com/pdfs/osj/Orion%20OSJ%202012%20-%20Fall.pdf
. Online Gaming for Charity ORION's Network Systems Administrator and self- professed computer geek Jason Clark participated in a 24- hour online gaming night in order to raise money for Extra Life
