Industry News | 2013-02-14 08:18:47.0
IPC – Association Connecting Electronics Industries® has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2013
Industry News | 2014-03-20 16:39:14.0
The best U.S. and International Papers of IPC APEX EXPO® 2014 have been selected.
Technical Library | 2018-02-28 22:28:30.0
Circuit functional density requirements continue to drive innovative approaches to high performance packaging. Some new approaches include; aggressive space reduction, embedded solutions, and those that offer some form of risk reduction and rework potential are now options that are being explored by customers. Requirements for assembly of these types of packages necessitate the deposition of solder paste and assembly of components into cavities of the substrates to gain z-axis density as well as area functional density. Advances in the fabrication of PWB’s with cavities using newly developed laser micro-fabrication processes along with increased circuit pitch density of 50 micron lines and spaces permit new applications for high performance electronic substrates. First published at SMTA Pan Pacific Symposium
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
Events Calendar | Tue Jul 18 00:00:00 EDT 2023 - Tue Jul 18 00:00:00 EDT 2023 | Chippewa Falls, Wisconsin USA
UMW Chapter In-Person Event: PCB 101 Workshop and Tour at TTM Chippewa Falls
, Polina Snugovsky, Eva Kosiba, Jeffrey Kennedy, Zohre
SMTnet Express, March 1, 2018, Subscribers: 31,280, Companies: 10,908, Users: 24,452 Deposition of Solder Paste into High Density Cavity Assemblies Fernando Coma, Jeffrey Kennedy, Thilo Sack; Celestica Corporation Circuit functional density
