Electronics Forum | Fri Dec 10 09:32:04 EST 1999 | Dave F
Joe: It might be tough to generalize about the number of times you can reform a lead before it is weakened beyond the point of reuse, because of different lead materials, thicknesses, amount of bending etc. It might be that "ugliness" is the answer
Electronics Forum | Thu Jan 11 09:19:56 EST 2007 | SMTRework
I know this is not the correct forum to post chip "reworking" questions but you guys have been very helpful in the past. My question is this, when we rework BGA components most of the time the solder reflows at a normal temp and all is well. On occ
| http://etasmt.com/cc?ID=te_news_bulletin,20361&url=_print
. The small reflow soldering machine must not be too long and the temperature is too high to cause copper and platinum blistering; the solder joints must be smooth and bright, and the circuit board must be tinned
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
component placement Too much paste has been applied to pads Preheat temperature is not high enough Solder bridging causes electrical shorts, which can make printed circuit boards malfunction during use
