Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
European supplier of Lead Free solder products like the paste compositions SnZnAl (low melting point), SAC, SnBi, flux, BGA Balls, solder wire, N2 Reflow Systems.
Industry Directory | Consultant / Service Provider / Manufacturer
Koczera Consulting LLC specializes in delivering quality 5DX and x6000 x-ray inspection applications to uncover defects.
New Equipment | Rework & Repair Equipment
BEST PCB circuit traces are designed to help you repair, replace and modify circuit traces on PCBs. These materials allow you to meet original PCB quality standards as the board side is microetched for improved bonding area and bond strength. The re
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
Electronics Forum | Wed Nov 26 09:16:59 EST 2008 | barryg
Hello everyone, after a short layoff I am glad to be back. I have a question. I have a button (snap button) that is being soldered to a strip of sac coated copper. We are questioning the joint strength of this from our vendor as we see these popping
Electronics Forum | Wed Nov 26 11:19:58 EST 2008 | vladig
I don't think you can find any specs on that. As long as a solder joint can not be broken by virtually "blowing over it" any reading on the UTS, or shear strength can be very confusing. You can specify, though that the assembly (joint) should withsta
Industry News | 2003-04-25 08:11:22.0
Diluted earnings per share for the quarter were $0.36 compared to the $0.24 earned in last year�s first quarter.
Industry News | 2003-02-11 08:42:41.0
To Handle Outbound Logistics Projects for OEMs and to Gain Greater Insight into Their Customers' Requirements for Global Direct-order Fulfillment
Parts & Supplies | Pick and Place/Feeders
This splice tape is used for jointing carrier tapes in the SMT process, It is made of 2 silver tapes and release paper. Size: 8mm, 12mm, 16mm, 24mm Main Characteristic 1, Peeling-off force(N/25mm)by angle of 180 degree. 2,Retaining(H/25*25mm)
Parts & Supplies | Assembly Accessories
Factory manufacturing yellow / bule / black SMT double splice tape special for Panasonic Product Description: 1.it has paper guide for aligning carrier tape.except its 2 tape strips sticking on top & bottom of carrier tapes. The 3rd tape strip is
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Career Center | , Washington USA | Engineering,Management,Sales/Marketing
Do yor sales abilities over sell your current EMS employer? Are you tired of bringing in millions of dollars of potential new business, only to find out your company cannot close the deals or doesn't have the capacity to handle your clients? If you
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New Model Evaluation • Testing & Evaluation of New TV models as per the relavant standards & release the defect free product for Mass Production • Measurement of audio parameters like Max out put, distotion, S/N ratio, hum, buzz etc • To conduct aud
Career Center | brampton, Ontario Canada | Engineering,Management,Production,Technical Support
- More than 14 years of experience in set-up, calibrate, program, troubleshoot SMT machines and SMT process, for the manufacturing of PCB Electronic Assemblies - 5 year experience in leading position for electronic manufacturing/Process Engineering.
The Future of Solder Joint Encapsulant Online Version SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced
SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. Solder joint encapsulant adhesives have been
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. The damage you may be causing by inducing accelerated intermetallic growth will far offset any gains in joint strength through a finer grain structure
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic417&OB=DESC.html
. i.e.: a side goal on Molded Body Inward L-Bend lead does nothing for the overall solder joint strength. However, the Toe and Heel Goals are very robust for this component family and this is where the solder joint strength is
