Industry Directory | Consultant / Service Provider
Elmet LLC is an accredited lab, primarily providing cross sectioning of circuit boards, visual and x-ray inspections of PCBAs and other metallographic and metallurgical services including SEM examination and EDS analysis.
New Equipment | Solder Materials
KappFree solder is a Lead Free, Cadmium Free formulation designed specifically to replace Lead solders in Copper and Stainless Steel plumbing, and in electrical and electronic applications. KappFree is simple, effective and easy to use in both manufa
New Equipment | Solder Materials
KappFree solder is a Lead Free, Cadmium Free formulation designed specifically to replace Lead solders in Copper and Stainless Steel plumbing, and in electrical and electronic applications. KappFree is simple, effective and easy to use in both manufa
Electronics Forum | Thu Oct 26 03:20:13 EDT 2000 | heccles
What would be a typical thermal test regime to verify the quality of solder joints for high specification applications - what would be the specific benefits of utilizing a "HALT" process over other traditional test techniques ?
Electronics Forum | Sat Nov 25 03:51:04 EST 2000 | carsonho
HALT is an approach to stimulate a failure till its existence. It is mainly used during product design and development phase. Traditional tests are mainly used to prove "no" failure but HALT is to make failure for information to improve in design of
Industry News | 2018-04-09 19:51:33.0
SMTA Europe announces Session 2 Technical Program on Reliability of Soldered Alloys at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2020-02-18 14:31:52.0
Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2014-07-10 17:37:18.0
This paper studies and compares the effects of pull–pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package.The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.
Visit the ADS200 Webpage for pricing and more information. https://www.paceworldwide.com/products/soldering-stations/digital-control-soldering-systems/ads200-accudrive-production-soldering-station-with-td200 The New ADS200 AccuDrive™ Production Sold
SMTnet Express, July 9, 2015, Subscribers: 23,004, Members: Companies: 14,461 , Users: 38,507 Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles Craig Hillman, Nathan Blattau; DfR Solutions , Matt Lacy; Advanced Energy
SMTnet Express, July 10, 2014, Subscribers: 22902, Members: Companies: 13928, Users: 36450 Fatigue Damage Behavior of a Surface-mount Electronic Package Under Different Cyclic Applied Loads. Ren Huai-Hui, Wang Xi-Shu - Wind Power Engineer
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
) of the solder joints. It is critical to understand if there is a correlation between area array solder joint voiding and the long term, thermal fatigue reliability of solder joints
Heller Industries Inc. | https://hellerindustries.com/bit_publications/the-effect-of-vacuum-reflow-processing-on-solder-joint-voiding-and-thermal-fatigue-reliability/
The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability. - Heller Industries Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
