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Kay and Associates is an employer of full time temporary personnel in engineering and technical services
One of three Interactive CD-ROMs developed for Soldertec Global by Bob Willis to assist engineers with the practical introduction of lead-free materials and processes. Introduced by Kay Nimmo, Technical Director, Tin Technology, the CD provides a ste
New Equipment | Solder Materials
MS2 Solder Dross Eliminator doesn’t just reduce solder dross associated with wave soldering machines – it actually eliminates it, whether you are working with leaded solder or lead-free alloys. MS2 molten solder surfactant works with your evolving
Electronics Forum | Thu Jan 19 14:15:48 EST 2006 | sarar
Me again - I actually just talked with one of the guys over at P Kay and Dan Feinberg of P Kay will be presenting a technical session on MS2 at APEX this year on February 9th. Just FYI! Sara Rice Foresite Inc. www.residues.com
Electronics Forum | Mon May 15 14:13:51 EDT 2006 | Chunks
M'kay, "I" see now. Thanks for straightening me out on the PIP process guys!
Industry News | 2010-06-16 12:45:24.0
BANNOCKBURN, IL — The Solder Products Value Council (SPVC) of IPC — Association Connecting Electronics Industries® issued the organization’s position statement on conflict metals during a Supply Chain Workshop held on May 20, 2010, by the Electronic Industry Citizenship Coalition (EICC) and the Global e-Sustainability Initiative (GeSI) in Vancouver, British Columbia.
Industry News | 2013-05-23 20:06:11.0
The SMTA proudly announces 33 engineers have received SMTA Certification for SMT Processes since May 2012. The SMTA Certification program is unique as it recognizes and certifies the entire SMT assembly process at an engineering level.
Technical Library | 2010-06-23 21:59:03.0
Quality control is one of the main bottlenecks in the production of micro-opto-electromechanical systems/microelectromechanical systems (MOEMS/MEMS) because each structure on a wafer is serially inspected and scanned stepwise over the entire wafer area.
Technical Library | 2020-09-02 22:02:13.0
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI) products migrating away from the current subtractive processes towards a more technically adept technique, based on an advanced modified Semi Additive Process (amSAP). This pattern plate process enables line and space features in the region of 20um to be produced, in combination with fully filled, laser formed microvias. However, in order to achieve these process demands, a step change in the performance of the chemical processes used for metallization of the microvia is essential. In the electroless Copper process, the critical activator step often risks cross contamination by the preceding chemistries. Such events can lead to uncontrolled buildup of Palladium rich residues on the panel surface, which can subsequently inhibit etching and lead to short circuits between the final traces. In addition, with more demands being placed on the microvia, the need for a high uniformity Copper layer has become paramount, unfortunately, as microvia shape is often far from ideal, the deposition or "throw" characteristics of the Copper bath itself are also of critical importance. This "high throwing power" is influential elsewhere in the amSAP technique, as it leads to a thinner surface Copper layer, which aids the etching process and enables the ultra-fine features being demanded by today's high end PCB applications. This paper discusses the performance of an electroless Copper plating process that has been developed to satisfy the needs of challenging amSAP applications. Through the use of a radical predip chemistry, the formation, build up and deposition of uncontrolled Pd residues arising from activator contamination has been virtually eradicated. With the adoption of a high throwing power Copper bath, sub 30um features are enabled and microvia coverage is shown to be greatly improved, even in complex via shapes which would otherwise suffer from uneven coverage and risk premature failure in service. Through a mixture of development and production data, this paper aims to highlight the benefits and robust performance of the new electroless Copper process for amSAP applications
Welcome to this Defect of the Month video on simple solderability testing, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years th
Career Center | Elk Grove Village, Illinois USA | Maintenance
Will set-up, maintain and operate I-Pulse (Amistar) SMT equipment.
Career Center | Buffalo Grove, Illinois USA | Engineering,Production
SMT Soldering Surface Mount and Through Hole, hand soldering. Must be experienced in reading parts lists and know how to identify electronics components. Job requires use of a microscope and/or a maginfying glass.
Career Center | King, North Carolina | Management,Production,Quality Control
Production Supervisor Responsible for all aspects of department operations Directly supervised up to 80 team members Kaizen team leader 5S, Lean Manufacturing, working with Six Sigma tools Built team that continually produced 98% yields and Won
| https://ipcapexexpo.org/sites/default/files/inline-files/SSSchedule300andbelow_0.pdf
May 19, 2020 10:00am ‐ 11:00am A028 P. Kay Metal, Inc. 200 Tuesday May 19, 2020 10:00am ‐ 11:00am A029 Air & Water Systems 200 Tuesday May 19, 2020 10:00am ‐ 11:00am A032 JLCPCB 100 Tuesday
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