Industry News | 2017-03-10 16:38:39.0
On Wednesday, March 29 Kester’s Bruno Tolla and Kyzen’s Mike Bixenman will present “Development of a Risk Profile from Flux Residues Trapped under Leadless Components” at the SMTA South East Asia Technical Conference on Electronics Assembly.
Industry News | 2022-11-15 12:17:46.0
Indium Corporation's David Socha, technology assessment manager, will present on Indium Corporation's innovative 3D-EZ-Release™ build plate, a cutting-edge technology that allows for the quick release of powder bed fusion (PBF) metal printed parts, at the TCT Conference at Formnext at 12:20 p.m. on Friday, Nov. 18 in Frankfort, Germany.
SMTnet Express, February 13, 2020, Subscribers: 34,017, Companies: 10,974, Users: 25,597 Size Matters - The Effects of Solder Powder Size on Solder Paste Performance Credits: FCT ASSEMBLY, INC. Solder powder size is a popular topic
| https://pcbasupplies.com/leaded-solder-wire/
× 105 Flux residue stickiness (by chalk powder) No attachment Wire diameter (mm) 0.3, 0.4, 0.5, 0.6, 0.8, 1.0, 1.2, 1.6 Shelf life 3 years More Flux Cored Solder Wire Products JM-20 Sn63/Pb37
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-38-clean-vs-no-clean-fluxes
don’t have to clean an RMA Flux. The flux hardens and can be left on. The problem most […] Question : We are using a Kester 186 RMA Flux for our assembly process
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