Industry Directory | Manufacturer / Other
DNA Group is a supplier of custom PCBA s, switches and many other board components as well as complete product builds.
Industry Directory | Manufacturer
Keteca USA manufactures dicing saw blades and dicing surfactants in its Arizona factory. We offer best performance and pricing and have much experience in ceramics, III-V materials and Si. quick turn arounds and USA made.
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Electronics Forum | Tue May 02 20:55:10 EDT 2006 | Board House
Hi all, I'm looking for anyone with info in regards to reliability of carbon ink vs. Immersion Gold Key pads. I have customers that still request Carbon Ink for there Key pads, while the majority have switch to Immersion Gold. Is there any readin
Electronics Forum | Wed May 03 15:56:25 EDT 2006 | Board House
Hi Patrick, Thank you for the info, We like to push ENIG, for us being the ENIG line is in house it is cheaper to use than the carbon, plus shelf life of the Carbon is an issue in Storage. Pre-application. Thanks again, Mike
Used SMT Equipment | Repair/Rework
SPLIT VISION MICROSCOPE STEREO WILD M3Z MICROSCOPE WITH ZOOM LENS COLOR DIGITAL CAMERA CAMERA MONITOR REMOTE KEY PAD CONTROLLER AIR/NITRO INLET INCLUDES 3 EACH NOZZLES FOOT SWITCH FOR GAS FLOW TOP AND BOTTOM 800 WATT HEATERS VENTURE VACUUM SYSTEM GRO
Used SMT Equipment | Repair/Rework
Zevac DRS 22L pc board assembly and manufacturing- swiss engineering Surface Mount Rework station LTP beam splitter vision system Zoom microscope Remote key pad controller Air/ Nitro inlet Includes 3 UNIVERSAL nozzles Foot switch for gas flow
Industry News | 2003-02-11 08:42:41.0
To Handle Outbound Logistics Projects for OEMs and to Gain Greater Insight into Their Customers' Requirements for Global Direct-order Fulfillment
Industry News | 2009-04-23 20:54:01.0
MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART > u FUJI S5120A SWITCH PHOTO FUJI S5124A SWITCH PHOTO FUJI S5125A SWITCH PHOTO FUJI S5126A SWITCH PHOTO FUJI S5128A SWITCH PHOTO FUJI S5129A SWITCH PHOTO FUJI S5133A SWITCH PHOTO FUJI S5134A SWITCH PHOTO FUJI S51
Parts & Supplies | Pick and Place/Feeders
USE ALTENATIVE PART > u FUJI S5120A SWITCH PHOTO FUJI S5124A SWITCH PHOTO FUJI S5125A SWITCH PHOTO FUJI S5126A SWITCH PHOTO FUJI S5128A SWITCH PHOTO FUJI S5129A SWITCH PHOTO FUJI S5133A SWITCH PHOTO FUJI S5134A SWITCH PHOTO FUJI S5135A SWITCH PHOTO F
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Technical Library | 2017-02-28 12:39:50.0
During the last 5 years mobile phones and other portable consumer electronics have been extremely popular and spread all over the world in different climate zones in very high volumes. At the same time the mobile phone terminal for many people has become a necessity that is brought with them in any activity they practice. These changes in user behavior have heavily changed the impact on handheld terminals from moisture, sweat, corrosive atmospheres and mechanical drop. As a result of this the requirement to solder joint reliability, corrosion stability and wear resistance are heavily increasing to keep a high reliability of the terminal.Immersion Ni/Au has been the overall dominant surface finish on Printed Wiring Boards (PWB's) for the last 10 years, but a paradigm shift to avoid use of this thin and porous surface finish is ongoing nowadays because it can’t address these challenges in a satisfactory way.In today's handheld terminals, Organic Solder Preservative (OSP) has replaced Immersion Ni/Au on solder pads. Carbon surface finish for Key- and spring contact-pads, combined with the right concept design can make use of Immersion Ni/Au unnecessary in the near future. The result will be higher reliability with less expensive and simpler processes.This paper will discuss the various considerations for choice of surface finish and results from the feasibility studies performed.
03059051-01 Lifting Table Dual Conveyor X4i 03059195-01 Retrofit kit pneumatic unit D1 03059196-01 Gas Spring 400N ( for D1/D2 Left Hood) 03059238S01 Linear Dipping Unit (LDU) Basis 03059375-01 Starter kit filter disc 2-parts / C+
03059486S01 COUPLER 03059594-01 Keyboard AK-4400-GU-W/GE 03059595-02 PS2-Tastatur Active Key mit Touch-Pad 03059733-01 Main switch 3LD2 with shaft length 59mm 03060396S01 station computer-HS50/60 (ESPRIMO P5915) 03060695S03 Splice Sensor B3+ / X
Training Courses | | | IPC-7711/7721 Trainer (CIT) Recert.
The Certified IPC-7711/7721 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Trainer (CIS) training.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Lincoln, Nebraska USA | Engineering
Brief Description of Job Duties: Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and r
Career Center | Lincoln, Nebraska USA | Engineering
Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and reliability for both rigid and foi
Career Center | , | Engineering,Sales/Marketing,Technical Support
Applications Engineer with over 20 years of combined Manufacturing/Field Service/Applications Engineering experience in the SMT industry.
Career Center | Reno, Nevada USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
Extensive technical background including tenures providing robotics technology expertise to diverse national and international clients and supporting surface mount technologies for printed circuit board (PCB) manufacturing processes. Results-oriente
Article Return to Front Page Key Drivers Of Custome
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/3839.html
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Imagineering, Inc. | https://www.pcbnet.com/services/assembly/turn-key/
Certifications Assembly Equipment Available Tolerances Certifications Services Fabrication Fabrication Production Prototyping Assembly Consignment Turn-Key Company Specials Get A Quote Menu Press enter to begin
