Electronics Forum | Wed Dec 15 17:42:50 EST 2010 | ck_the_flip
We do not have capabilities with our current PCB layout software to generate a pick and place file and/or centroid data. Consequently, we are teaching all centroids at the machine. Are there any software tools or utilities that can take a basic ger
Electronics Forum | Thu Dec 16 12:16:12 EST 2010 | jdengler
You may want to also check out a cheaper package. They advertise here. Unisoft is a simpler package which makes it cheaper. http://www.unisoft-cim.com/ Jerry
Industry News | 2003-01-31 09:39:08.0
Expected to be Below the Guidance Provided During the Company's Earnings Conference Call on December 18, 2002
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2021-02-20 00:55:47.0
Customers must be able to rely on accurate humidity indication as an assurance of SMD quality and fitness for processing and use. Without it, they might accept SMDs from suppliers that have already been irreparably damaged by moisture during storage or transit. Or, they might approve for processing SMDs that have been improperly or insufficiently heat-dried. Beyond the processing questions, there are financial questions: Where did the dry pack problems originate and who--supplier, customer, shipper--is financially responsible for the damaged SMDs? In response, Clariant, the originator of the color change humidity indicator card, and a member of the JEDEC's Subcommittee 14.1, "Reliability and Test Methods for Packaged Devices," created a new "non-reversible" halogen and cobalt dichloride free humidity indicator card. This HIC combines two reversible indicators (5% and 10%) with a new non-reversible (60% RH) indicator spot. (Figure 1) The 5% and 10% reversible spots work the way similar indicators do: they change color from blue (dry), to lavender, to pink (wet) to indicate humidity exposure at the indicated levels. If humidity levels drop, they will gradually revert back to blue.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Events Calendar | Tue Feb 14 16:00:00 EST 2017 - Tue Feb 14 16:30:00 EST 2017 | San Diego, California USA
Invited Speaker at APEX 2017 - Managing the Diminishing Supply and Obsolescence of PCBs for Legacy Systems
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. According to the IPC standard, non-wetting is defined as the inability of molten solder to form a metallic bond with the base metal. This results in the PCB pads or the
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_08_19_09.pdf
7.6.4 Dim G states that “wetting is evident” Is it implied or specified the amount of the joint that must show wetting? 11 #4 Wetting is Evident
