Electronics Forum | Fri Nov 17 07:58:06 EST 2006 | markb
SWAG - I also forgot to mention a few things. Our delmaination was always between the large copper plane and the laminate. It is a multi-layered board, so even when the delamination appeared around components (through visual inspection), cross-sect
Electronics Forum | Thu Nov 16 11:45:15 EST 2006 | markb
I still think the best bet is probably an SMT pre-bake operation to ensure that there is no moisture in the board. Vapor pressure is usually the leading cause for delamination, so removing the source should significantly help out. Unfortuantely, pr
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
Solder Dictionary of Terms | Nordson EFD Search Arrow Black Arrow Right Arrow Youtube Twitter Facebook Paper Plane LinkedIn Zoom In Grid Envelope Earth Download File - Document 9 Boxes Browser Calendar Chart Click Icon Close
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. Aspandiar characterized and classified BGA solder joint voids into several categories with assigned root causes that are widely utilized as ‘the
