A Revolutionary Print Solution with Integrated Post Print AOI The VERSAPRINT series not only handles the automatic cleaning of the underside of the stencil and inspection of the printing result, with a choice of 2D or 3D inspection, it also carries
Electronics Forum | Tue Feb 28 11:15:20 EST 2006 | billyd
In my last life we had pretty good luck with the Grid-lok system. Just not very good for extremely large boards, or very thin ones. (Tends to push thin ones up and bend them before the table rises. **On DEK printers, mind you) Form-flex was a nightma
Electronics Forum | Tue Feb 28 14:49:48 EST 2006 | vdizzle
Yep Grid-Lok sucks for thin boards. We have it set up in 4 Dek Horizon 01s. Grid-Lok is actually strong enough to snap really thin boards. Other than that, the system has been great, especially if you have to do 10-12 changeovers per line per shif
Industry News | 2011-01-27 15:53:22.0
Providing the latest information on design innovations and best practices, the IPC Designers Forum and several design-focused educational programs and activities will be held at IPC APEX EXPO 2011, April 10–14, 2011, in Las Vegas.
Industry News | 2010-02-08 12:16:04.0
DEK is preparing to showcase a comprehensive range of advanced technologies and processes at this year’s Electronics Next exhibition in conjunction with the company’s agent Maxim SMT Technologies Pvt. Ltd. Being held in New Delhi over February 24th – 26th, Electronics Next will see the mass imaging specialist demonstrate its state-of-the-art Horizon screen printing platform along with award-winning Productivity Tools from Stand 501.
After six months of successful field testing under full production conditions at customers in Germany, ERSA introduced two series machines at this year's Productronica: the VERSAPRINT P1 and the VERSAPRINT S1. Both machines include the LIST camera an
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EM-Power Europe Restart 2021
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Lewis & Clark | http://www.lewis-clark.com/product-tag/horizon-03/
: Horizon 03iX Vintage: 2011 Software version: 09SP13P02 Details: Green Camera Under Stencil Wipe Vacuum Edge Clamping Grid Lok® Hook up Dropbox to additional photos: https
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-assembly-and-packaging?con=t
0.1 micron feature recognition for a Diamond system), are more than capable to handle demanding applications including metal cored boards and copper backed Ball Grid Arrays (BGAs
