Industry Directory | Consultant / Service Provider / Manufacturer
Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
New Equipment | Design Services
Electrical Signal Integrity & Simulation Services Electrical Signal integrity to measure the quality of your electrical signal. Simulation services that include multiple analyses. Pre Layout Simulation Post Layout Simulation
KS-635 Lead-free Fully Computer-controlled Reflow Oven Model KS-635 Heating part parameter Number of heating zones Up 6 down 6 Length of heating zone 2100mm Heating method Hot Air
Electronics Forum | Thu Feb 01 19:31:10 EST 2024 | SMTA-74685453
I am curious if there is any benefit to using two different PCB paste layouts on one stencil. If I have a small PCB with a layout that doesn't take up much space on the stencil, would it be worth it to have both the secondary and primary side apertur
Electronics Forum | Thu Feb 01 20:25:22 EST 2024 | jdengler
We do this often on smaller boards. More than saving money it reduces the storage space.
Used SMT Equipment | Pick and Place/Feeders
Refurbished YAMAHA YV100XG SMT Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute accuracy (μ + 3σ): ± 0
Used SMT Equipment | In-Circuit Testers
JDSU NT955 Key Features Conducts Bit Error Rate (BER) testing to speed certify Ethernet data transmission speed up to 1000BASE-T (1 Gb/s) Measures Signal-to-Noise Ratio and Skew to uncover impairments to Ethernet data transmission Tests for opens
Industry News | 2016-01-07 19:49:42.0
Signal Integrity & Simulation
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Parts & Supplies | Pick and Place/Feeders
Keyboard, German Layout
Parts & Supplies | Pick and Place/Feeders
1. Suitable for SMT workshop Feida lay-out, prepare feeder material in advance, improve production efficiency. 2. Stainless steel welded as a whole, the frame is never deformed. 1. Mainly use 30 * 30 MM stainless steel 2. With four caster wheels (two
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2020-04-14 15:49:38.0
The number of through-hole components on printed circuit boards (PCB) has declined significantly over the last decade. Miniaturization in electronics has resulted in less THT (through-hole technology) and leads with a finer pitch. For this reason, the soldering of these components has also changed from wave soldering to Point-to-point selective soldering. Soldering these small, fine-pitch components is a challenge when surface mount components (SMD) are positioned very close to THT components on the PCB layout. This study, done in cooperation with a large automotive EMS customer, defines the process windows for through-hole technology for fine-pitch components. It determines what is feasible to solder and defines layout design parameter that make soldering possible with SMD areas and other components on the assembly.
The newly redesigned EasyCoat® 6 software for conformal coating combines several powerful capabilities to deliver a simplified programming experience that reduces programming time, increases throughput and productivity, and achieves high quality coat
Nordson ASYMTEK's Panorama S-Line delivers conformal coating process control in a compact footprint – with overlapping line processes that minimize manufacturing floor space use up to 50%.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | IPC Designer Certification CID
The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.
Events Calendar | Wed Jul 13 00:00:00 EDT 2022 - Wed Jul 13 00:00:00 EDT 2022 | Oshkosh, Wisconsin USA
Wisconsin Chapter: PCB Workshop and PCB Plant Tour
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Career Center | San Jose, CA, California USA | Engineering,Production,Research and Development
Senior PCB Designer: Want to be part of an exciting pre-IPO enterprise B2B company working on the cutting edge of internet-of-things, artificial intelligence & agents, blockchain, and manufacturing technology? This well-funded venture-backed co
Career Center | Fremont, California USA | Engineering
Interprets electrical design requirements and uses Allegro design tool to create original PCB layouts, detailed fab drawings, schematics, and other design files. Work with HW design engineer to make sure PCB layout meet PCB design requirements.
Career Center | GOBICHETTIPALAYAM, India | Engineering
PCB design, layout and packaging of high-speed, high-density, Mixed Technology Analog / Digital signals & RF signals, Flex, Rigid board, Commercial, Application Boards, based on client requirement and Quality Inspection of the design.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/grid-for-part-creation-and-placement_topic2533_post10423.html
Posted: 30 Sep 2019 at 10:42am It depends on the type of PCB layouts you have. High Density or Low Density. For PCB layouts that have Low Density part placements, the best PCB library "Pad Size" round-off and "Pad Place Round-off" grid would be 0.05 mm
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/brand/identity/powerpoint
& INSPECTION Template Example Presentation with Common Slide Layouts Nordson Template - Confidential Nordson EFD - Confidential Nordson ELECTRONICS SOLUTIONS - Confidential Nordson MEDICAL - Confidential Nordson TEST
