Industry Directory: leaching gold from component leads (3)

Advance Devices, Inc.

Industry Directory | Other

Advance Devices, Inc. offers Smart Tweezers LCR Meter - excellent tool for identification testing of SMD Components.

Fischer Technology, Inc.

Industry Directory | Manufacturer

As trends towards the miniaturization and increased functional integration of electronics, the demands on quality assurance are rising. FISCHER has many coating thickness measurement solutions for the electronics sector.

New SMT Equipment: leaching gold from component leads (17)

Wraparound Thick Film Chip Resistors

Wraparound Thick Film Chip Resistors

New Equipment | Components

RCX Series Resistors Versatile Wrap-Around Chip With resistance values from 1ohm to 1Teraohm, RCX Series resistors are ideal for a wide variety of applications. Wraparound terminations are perfect for epoxy or solder attachmen

International Manufacturing Services (IMS)

GoldFish Electronics Ltd.

GoldFish Electronics Ltd.

New Equipment |  

GoldFish a leading Irish electronic product solutions company, providing customised electronic components, hardware and software design services. We are dedicated to providing components and design services at a competitive price combined with a qual

goldfish

Electronics Forum: leaching gold from component leads (109)

Re: Tinning gold plated leads ( DIP, etc)

Electronics Forum | Tue Mar 21 20:25:30 EST 2000 | Dave F

John: What�s the matter? Free gold � good thing for you, bad thing for your supplier. :^) Pre-tinning of gold plated leads is important to: � Prevent gold embrittlement of the solder joint � Determine if the leads are solderable prior to assembly (

Tinned leads and where the component body is defined

Electronics Forum | Wed Sep 02 15:02:36 EDT 2020 | SMTA-64387501

We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned po

Industry News: leaching gold from component leads (146)

IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS

Industry News | 2011-08-18 21:23:09.0

For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.

Association Connecting Electronics Industries (IPC)

IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS

Industry News | 2011-08-18 21:24:08.0

For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.

Association Connecting Electronics Industries (IPC)

Technical Library: leaching gold from component leads (3)

Factors That Influence Side-Wetting Performance on IC Terminals

Technical Library | 2023-08-04 15:27:30.0

A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.

Texas Instruments

Factors That Influence Side-Wetting Performance on IC Terminals

Technical Library | 2024-04-08 15:46:36.0

A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.

Texas Instruments

Videos: leaching gold from component leads (2)

Viscom AOI

Viscom AOI

Videos

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

ORPRO Vision SPI Presentation

ORPRO Vision SPI Presentation

Videos

ORPRO Vision SPI Presentation. This presentation introduces the methods and technology used by ORPRO Vision in the Symbion P36 Plus SPI system. For additional information, please contact ORPRO Vision at sales.us@orprovision.com sales.eu@orprovision

Orpro Vision GmbH

Career Center - Resumes: leaching gold from component leads (2)

Sr. Process & Quality Engineer

Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support

Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.

Technology NPI R&D Eng Tec

Career Center | Stoneham, Massachusetts | Engineering,Production,Research and Development,Technical Support

Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic

Express Newsletter: leaching gold from component leads (1068)

Defect Free QFN Assembly

Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder

Partner Websites: leaching gold from component leads (93)

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

. Some typical brazing alloys include copper-zinc, copper-gold, copper-phosphorous, and silver-based alloys. The melting temperatures for brazing alloys range from 450° C (852° F) to 1100° C (2012° F

ASYMTEK Products | Nordson Electronics Solutions

Blackfox Counterfeit Components Course Overview

Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/counterfeit-components-course-overview/

] Program Insight/Overview – CURRENT STRATEGIES FOR MITIGATING COUNTERFEIT COMPONENTS PRESENTED BY RICK STANTON – PRO-STD-001 COURSE DIRECTOR/CORPORATE VP OF QUALITY IC Leads Contaminated Leads Gold Plated Module Lead Lead Re-attachment Documented by the Department of Commerce, Counterfeit Electronic components

Blackfox Training Institute, LLC


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