Industry Directory | Manufacturer
Data I/O is the world's leading provider of manual and automated programming solutions for semiconductor (IC) devices. Data I/O's solutions, software and programming engine ensures devices are programmed correctly every time.
Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
► Exclusive 10MP / 18MP Camera Technology ► Precision Telecentric Compound Lens Design ► Eight Phase Color Lighting System ► 10MP / 18MP SIDE-VIEWER® Camera System ► Extremely Simple Programming and Operation ► Integrated INTELLI-SCAN® L
Panasonic NPM D3A Pick and Place Machine Equipment If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place
Electronics Forum | Wed Dec 15 05:15:46 EST 1999 | Marlies Hanf
Hi. Can someone explain to me what coplanarity is? There are a few rather irritating and contradictory definitions of that term. When leads are coplanar - what are they then? Are they parallel to each other or not? Thanks, Marlies
Electronics Forum | Thu Dec 16 06:59:12 EST 1999 | Calvin Wong
Coplanarity also takes into consideration which is your reference plane. In the case of connectors, you can consider coplanarity between the highest and the lowest lead. Also, you can consider all the connector leads with reference to the connector
Used SMT Equipment | AOI / Automated Optical Inspection
(2) Orbotech Automated Optical Inspections Machines For Sale Machine were just taken out of Military OEM facility in good working condition Both machines are being sold together at discounted price See attached pictures and information below
Used SMT Equipment | SMT Equipment
CM401-L Placement Machine B-type (MF) 2 Feeder Carts CE-Mark Transformer for 230/400 V 50 Hz 930 mm Pass line height 930 mm PCB Transfer Height (per Gang Cart) NG Components Ejection Conveyor Upstream Extension Conveyor Tray Lifter Shuttle (ST40S-20)
Industry News | 2012-09-13 10:44:36.0
MIRTEC, “The Global Leader in Inspection Technology”, announced that it will premier its Technologically Advanced AOI Equipment at SMTAI Orlando 2012
Industry News | 2013-12-05 16:48:11.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it has been selected as a finalist for the 2014 Best in Test Awards in the Machine Vision/Inspection category for its MV-9 2D/3D CoaXPress In-Line AOI Series. Since 1991, the Best in Test Awards have recognized the best in test products and test professionals.
Parts & Supplies | Pick and Place/Feeders
1. Special feature 1.1 Placing heads ("auto-tools") are exchanged automatically during production：The XPF is the world's first machine to feature dynamic head exchange.The machine can switch between a high-speed placing head and a multi-purpose hea
Parts & Supplies | Pick and Place/Feeders
Brand: FUJI Name: High Speed Multi Purpose Mounter Number Of Nozzles: 12pcs Supported Parts: 0402(1005) Lntelligent Feeders: Support For 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, And 104 Mm Wide Tape Weight: 1860KG High-speed Multi-Purpose Mounter XPF
Technical Library | 2021-04-08 00:30:49.0
As the electronic industry moves to lead-free assembly and finer-pitch circuits, widely used printed wiring board (PWB) finish, SnPb HASL, has been replaced with lead-free and coplanar PWB finishes such as OSP, ImAg, ENIG, and ImSn. While SnPb HASL offers excellent corrosion protection of the underlying copper due to its thick coating and inherent corrosion resistance, the lead-free board finishes provide reduced corrosion protection to the underlying copper due to their very thin coating. For ImAg, the coating material itself can also corrode in more aggressive environments. This is an issue for products deployed in environments with high levels of sulfur containing pollutants encountered in the current global market. In those corrosive environments, creep corrosion has been observed and led to product failures in very short service life (1-5 years). Creep corrosion failures within one year of product deployment have also been reported. This has prompted an industry-wide effort to understand creep corrosion
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Panasonic NPM D3A Pick and Place Machine Equipment If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/articles/combining-2d-and-3d-aoi-the-most-effective-inspection
) has become an essential tool in today’s surface-mount-technology (SMT) manufacturing environment. Growing trends towards the use of smaller components, more advanced component packaging, finer lead pitches and higher printed-circuit-board (PCB
| http://etasmt.com/te_news_bulletin/2019-08-05/9161.chtml
. The coplanarity of related components cannot be ignored. For components with poor coplanarity, it is recommended to discard components with better coplanarity
