Industry Directory: lead forming thermal pad (16)

AI Technology, Inc. (AIT)

Industry Directory | Manufacturer

Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.

TennMax Inc

Industry Directory | Manufacturer

TennMax Inc is EMI and Thermal Management Specialist. We offer total solutions for any EMI and thermal applicatons.

New SMT Equipment: lead forming thermal pad (61)

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

New Equipment | Software

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

Waterjet Cutting

Waterjet Cutting

New Equipment | Other

Waterjet allows for improved cutting tolerances, improved lead times and the ability to provide highly complex geometry. Using a stream of water with forces of 55,000 PSI yields fast production rates and tool free cutting. Our single head and 4-head

ORION Industries

Electronics Forum: lead forming thermal pad (280)

Solder short-BGA with thermal pad

Electronics Forum | Sat Dec 28 02:58:12 EST 2002 | emeto

If the problem is in the big thermal pad.The surface strains in that pad are different then the others and through the reflow period there is an affinity between them(only if they are too close). I recommend you to reduce the theramal pad. Make smal

forming axial-lead for elavated horizontal soldering to SMT pad

Electronics Forum | Wed May 26 05:05:04 EDT 2004 | curious

hi, we have a batch-rework for a axial 2-lead LED component. we are thinking of bending both ends of the axial-leads into a L-shape at 90degree angle, and solder the flat-end of the L-shape flatly to the PCB's SMT pad. hope the experienced guys/exp

Used SMT Equipment: lead forming thermal pad (8)

Pillarhouse JADE MKII

Used SMT Equipment | Soldering - Selective

Pillarhouse Jade MKII Selective Soldering Machine Model: Jade MKII Year: 2016 Lead-Free Drop Jet Fluxer Top Side IR Pre-Heat Auto Soler Top-Up & Solder Level Detect Inerted Nitrogen System Thermal Nozzle Calibrati

Midwest SMT

Ekra E4

Ekra E4

Used SMT Equipment | Screen Printers

EKRA E4 AUTOMATIC SCREEN PRINTER Auction Item: www.xlineassets.com Complete Manufacturing Closure Other Available Equipment Includes: Assmebleon MG1 and Topaz X Pick and Place Assembleon Feeders Ekra Screen Printers Electrovert Vectra Wave S

X-Line Asset Management

Industry News: lead forming thermal pad (389)

Stencils Optimise Paste Release

Industry News | 2003-03-21 08:12:24.0

Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.

SMTnet

Fairchild Announces Industry's First SSOT-6 FLMP N-Channel MOSFETs

Industry News | 2003-05-22 08:36:27.0

Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability

SMTnet

Parts & Supplies: lead forming thermal pad (8)

Juki JUKI 501 NOZZLE

Juki JUKI 501 NOZZLE

Parts & Supplies | Chipshooters / Chip Mounters

> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700) JUKI

ZK Electronic Technology Co., Limited

Universal Instruments AI part 255488000 mirror

Universal Instruments AI part 255488000 mirror

Parts & Supplies | Pick and Place/Feeders

Universal AI part 255488000 mirror Other Universal AI parts in stock: 1     30952105       ACTUATOR                        2     30952306       BLOCK                        3     30952602       HOUSING                          4     3095280

ZK Electronic Technology Co., Limited

Technical Library: lead forming thermal pad (24)

StencilQuick™ Lead-Free Solder Paste Rework Study

Technical Library | 2007-01-31 15:17:04.0

The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.

BEST Inc.

Defect freeQFN Assembly

Technical Library | 2011-06-09 20:28:30.0

QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and

AccuSpec Electronics, LLC

Videos: lead forming thermal pad (31)

PCB Footprint Expert

PCB Footprint Expert

Videos

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

Training Courses: lead forming thermal pad (9)

IPC-7711/7721 Trainer (CIT) Recertification Course

Training Courses | | | IPC-7711/7721 Trainer (CIT) Recert.

The Certified IPC-7711/7721 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Trainer (CIS) training.

Blackfox Training Institute, LLC

BGA Rework Training & Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: lead forming thermal pad (4)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Career Center - Jobs: lead forming thermal pad (2)

Process Development Engineer

Career Center | , New York USA | Engineering,Research and Development

DESCRIPTION � Responsible for the development and deployment new printed circuit board assembly processes. � Will assume responsibility for Pb-free/RoHS project management & implementation. � Plans, directs, and coordinates manufacturing processes

F-O-R-T-U-N-E Personnel Consultants of Huntsville

Process Development Engineer

Career Center | , Illinois USA | Engineering,Research and Development

DESCRIPTION � Responsible for the development and deployment new printed circuit board assembly processes. � Will assume responsibility for Pb-free/RoHS project management & implementation. � Plans, directs, and coordinates manufacturing processes

F-O-R-T-U-N-E Personnel Consultants of Huntsville

Career Center - Resumes: lead forming thermal pad (3)

SMT process engineer

Career Center | NORTHRIDGE, California USA | Engineering

EDUCATION BS Electronics and Communication Engineering                Gujarat University MS Electrical Engineering        California State University, Northridge  ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE

Resume

Career Center | kerala, any ware India | Production

i have experience in                                                                           • Operation of wave soldering and water cleaning machine • Inspection ( Reflow and Post Wave ) • Pre Reflow inspection in SMD • Component forming stuffi

Express Newsletter: lead forming thermal pad (845)

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend

Partner Websites: lead forming thermal pad (654)

IPC-7093A BTC: QFN Solder Mask Defined Thermal Pad - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154_post11220.html

IPC-7093A BTC: QFN Solder Mask Defined Thermal Pad - PCB Libraries Forum   Forum Home > Libraries > Footprints / Land Patterns    New Posts    FAQ    Search    Events    Register

PCB Libraries, Inc.

Thermal Interface Material (TIM) | Nordson ASYMTEK

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/thermal-interface-material-tim

. The pads are reworkable and sensitive to applied pressure, improving performance when higher pressure is applied.  Dispensable TIM vs. Thermal Pads Compared to solid, stamped thermal pads for dissipating heat, thermally conductive fluids are ideal for filling gaps of various sizes, forming complex dispense patterns, and achieving

ASYMTEK Products | Nordson Electronics Solutions


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