New SMT Equipment: lead peeling test bga kgf (1)

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Electronics Forum: lead peeling test bga kgf (9)

Axial capacitor Pull out force

Electronics Forum | Tue Aug 21 20:52:06 EDT 2007 | davef

There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some lea

BGA shorts that can't be found.

Electronics Forum | Wed May 21 09:31:09 EDT 2003 | caldon

I need to first understand what "Peeled the BGA off" means. Was heat used? was this the pry and lift method? We had shorts under some BGA's we have and the solder was bridging from lead to lead but not on the board level at the FR4 on the BGA creati

Industry News: lead peeling test bga kgf (1)

IPC Honors Best Papers at IPC APEX EXPO� 2009

Industry News | 2009-04-15 23:01:13.0

BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.

Association Connecting Electronics Industries (IPC)

Express Newsletter: lead peeling test bga kgf (997)


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