Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Electronics Forum | Sun Apr 12 12:55:11 EDT 1998 | Bob Willis
| I would like to invite everyone to share/discuss | information/knowledge/experience they have with | the req's that are assumed to be valid for the | temperature/time relation in the process of reflow | soldering Pin In Paste, Intrusive Reflow or w
Electronics Forum | Thu Nov 28 20:00:42 EST 2002 | iman
ran an internet search on "intrusive reflow", out popped various links on the subject. Bob Willis was rather prominent on the topic's links. anyway seems intrusive reflow soldering specs are the same as conventional manual insertion (radial, axial)
Industry News | 2010-09-30 00:35:51.0
The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.
Industry News | 2013-07-29 10:38:07.0
A picture is worth a thousand words so they say. So say it with photos
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Eliminate Body Stress with Versatile CF-8 Lead Former GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exactin
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Defect Coverage for Non-Intrusive Board Tests Defect Coverage for Non-Intrusive Board Tests Non-intrusive board test (NBT) is an emerging test methodology that integrates several complementary embedded-instrumentation-based test technologies
PCB Libraries, Inc. | https://www.pcblibraries.com/Products/FPX/Xpedition.asp
. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well. 2 IPC B: Median (Nominal) Land Protrusion
