Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Equipment Dealer / Broker / Auctions
A dealer of high quality Used SMT Equipment, Used Plastic Injection Molding Equipment, Used Machine Tools, Used Semiconductor Machinery, and Used Industrial Machinery.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces the new ezLOAD PCB Support System. With the recent increase of densely populated double-sided circuit boards, COT recognized the need for more affordable
New Equipment | Assembly Services
As leading one-stop PCB Assembly services provider in China, Hitech Group offers high quality, cost effective, express PCB board products and provides PCB manufacturing, electronics assembly manufacturing, components sourcing, Box build assembly and
Electronics Forum | Wed Aug 25 21:25:28 EDT 2004 | davef
First as a nit, your �substrate� is probably NOT copper. It�s probably FR4 fiberglass/epoxy. Substrate. Base Material. A supporting insulating material upon which parts, components, and elements are attached. Second, enough of that, on to your i
Electronics Forum | Tue Aug 24 21:52:06 EDT 2004 | rose
recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was reflowed u
Used SMT Equipment | Soldering - Wave
400V 50/60 HZ Version ERSAsoft for: 4.050.000.000 2. Operating System Dell / Windows 7 Processor: Pentium(R) Dual Core E5800 @ 3.20GHz 3.19GHz Memory RAM: 4.00 GB (3.46 GB usable) 320bit Operating System Touch Screen – No Pen Touch, input is availabl
Used SMT Equipment | SMT Equipment
Product Name: Samsung CP45FV-NEO multi-function chip mounter Product number: CP45FV-NEO Detailed product introduction Samsung CP45FV-NEO multi-function chip mounter Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max sp
Industry News | 2013-09-10 17:48:54.0
We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Parts & Supplies | Assembly Accessories
TEST PCB LP3 ..00359534-01 Tester PEL-2002A Push pull tester NK-500 Neon lamp tester SX-C Test Probes (Universal Probe) TL20 Probes Connector Test Point temp (Male) SMPW-K-M. DIP TESTER DS-10
Parts & Supplies | Assembly Accessories
TEST PCB LP3 ..00359534-01 Tester PEL-2002A Push pull tester NK-500 Neon lamp tester SX-C Test Probes (Universal Probe) TL20 Probes Connector Test Point temp (Male) SMPW-K-M. DIP TESTER DS-10
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-08-16 18:42:25.0
In one of our medical applications projects, the customer wanted to dispense a mask to protect gold leads and an underfill on a silicon substrate with a clear test die. The substrates were Dymax X-499-91-C for Masking and Epoxibond-106M-1 for Underfill Dispensing
https://www.ascen.ltd/component_tape_feeder/ tape component forming feeder|axial lead tape feeder|radial tape feeder can as SMT insertion component feeder use to connect the SMT component insertion machine for automated pick up,also can as the taped
https://www.ascen.ltd/component_tape_feeder/ tape component forming feeder|axial lead tape feeder|radial tape feeder can as SMT insertion component feeder use to connect the SMT component insertion machine for automated pick up,also can as the taped
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Jul 22 00:00:00 EDT 2021 - Thu Jul 22 00:00:00 EDT 2021 | ,
Webinar: Effective Strategies to Sharpen Your Focus and Concentration
Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,
SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Brooklyn, New York USA | Engineering,Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | bangalore, India | Management
• Hands on experience in planning functions i.e. material planning, scheduling, inventory management. • We have a good knowledge of BOM, KANBAN, MIN-MAX order quantity, • We have Good knowledge in ERP Baan System , • Demand adjustment as per cu
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
SMTnet Express, August 13, 2015, Subscribers: 23,186, Members: Companies: 14,558 , Users: 38,745 Pad Cratering Susceptibility Testing with Acoustic Emission Wong Boon San, Julie Silk; Agilent Technologies | Richard Nordstrom, Ph.D.; Acoustic
SMTnet Express, May 9, 2019, Subscribers: 31,902, Companies: 10,760, Users: 26,083 Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material Credits: iNEMI (International Electronics
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/n980a1741-drawer-pull-214158?page=277&order=list_price+asc
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