Industry Directory | Manufacturer
Full service PCB assembly company. SMT,thru-hole and mixed technologies. Fine pitch, BGA assembly. Turnkey or consignment. Leaded and RoHS compliant. IPC-A-610 class 3 standard.
Industry Directory | Manufacturer
SAFE-PCB Group is a global leading provider of time-critical and technologically complex PCBs, attractive for small and medium volume quick-turn orders. We provide 2-hour images for validation, same day production, and wide range.
New Equipment | Education/Training
The IPC J-STD-001 Training for the instructor is a class on the necessities for Soldered Electrical and Electronic Assemblies is a universal standard with wide acceptance on the assembly of printed circuit boards. The IPC J-STD-001 Training explains
http://www.flason-smt.com/product/SMT-AOI-Machine.html SMT AOI Machine ZW 800 Inspection Component: 0201 chip PCB size::25x25-480*330mm Dimension:980*1080*1410 mm Weight: 600kg Product description: SMT AOI Machine ZW 800 INQUIRY
Used SMT Equipment | SMT Equipment
Auction: Phoenix X-Ray PCB Analyser, Wafer Probers, Test Chambers, Hot Bar Bonders, Dicing Saws & More Featuring: BAE - Manassas, Virginia USA • V.J. Technologies VJ-1000 X-Ray System A World Class Semiconductor Mfg. Co. - Hayward, California USA
Used SMT Equipment | AOI / Automated Optical Inspection
Mirtec MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13100524-0524 DOM: 24 MAY 20102D InspectionPower: 85-264V / 4.4A / 50-60 HzINSPECTION AREA: 450 x 400 mmINSPECTION ITEMS: Lifted Lead, Lifted Comp
Industry News | 2003-02-04 08:49:40.0
John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001
Industry News | 2003-05-21 09:03:19.0
Cadence Design and Analysis Solution Used for Asus's Ultra-high-frequency PCB Designs
Technical Library | 2016-07-28 17:00:20.0
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.
Technical Library | 2017-10-12 15:45:25.0
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.
SMT 3D AOI Automatic Optical Inspection Machine - Precise Defect Detection Solution ❙ Introduction of Off-line SMT AOI Our SMT 3D AOI Automatic Optical Inspection Machine offers precise defect detection capabilities for Surface Mount Technology.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Oct 12 18:30:00 UTC 2020 - Wed Oct 14 18:30:00 UTC 2020 | San Jose, California USA
International Wafer-Level Packaging Conference (IWLPC)
Career Center | Wilmington, Massachusetts USA | Engineering,Management,Research and Development
The primary responsibilities of the Test Engineer manager include managing the test process to support New Product Introductions to ensure the manufacturing test process is qualified and on-line to meet the product launch schedule. Reduce Test Cycle
Career Center | St. Charles, Illinois USA | Engineering,Maintenance,Production
An established Contract Electronics Mfg. in the Western Suburbs of Chicago is looking for an individual that values hard work and understands the opportunity of working with a mid-sized company for growth potential. Long-term full-time position 8:00a
Career Center | Stoneham, | Engineering,Production,Research and Development,Technical Support
Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic
Career Center | , | Engineering,Management,Production,Purchasing,Research and Development,Sales/Marketing
Professional Summary Experienced in all aspects of high tech business management with special skills in product and organizational innovation through growth and start-up efforts. Knowledge base extends through 12 years in the custom capital equipme
Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-services/class-3-facility/
IPC Class 3 Facility Training - Blackfox Institute Skip to content Phone: (888) 837-9959 | sharonm@blackfox.com Store | Home | EN ES Search for: Course Calendar Course Calendar 2023 IPC Certification Online IPC Training IPC Instructor Online IPC Training IPC A-610 CIT IPC A-610 CIT Recertification IPC J-STD-001 CIT IPC J-STD-001 CIT
| https://www.eptac.com/webinar/tempered-leads-class-3-rework-toe-fillets-and-more/
Tempered Leads, Class 3 Rework, Toe Fillets and More | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
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