Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Consultant / Service Provider
Lead Conditioning, Lead Scanning, Tape & Reel, Lead Tinning, Bake & Dry-Pack, BGA Reballing Services
New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Electronics Forum | Fri Apr 07 11:19:55 EDT 2006 | muse95
Technically speaking, most likely yes it will work, unless possibly it is a BGA. There are issues surrounding BGA's. Here are some of the general issues: On any type of component, if the Pbfree solder you are using contains bismuth, then the Pb in
Electronics Forum | Thu Apr 13 02:31:16 EDT 2006 | raqi16
Thank you! sorry, i just realized my posted question was not very specific.. no, it's not a BGA part, it's just a standard surface mount device and the only leaded part are the leads.
Used SMT Equipment | Soldering - Selective
This machine will be coming available for purchase soon. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: Version
Used SMT Equipment | SMT Equipment
Product Name: Samsung CP45FV-NEO multi-function chip mounter Product number: CP45FV-NEO Detailed product introduction Samsung CP45FV-NEO multi-function chip mounter Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max sp
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2005-12-29 16:54:11.0
The only complete coverage on Lead-Free from Preparation to Production to Reliability
Parts & Supplies | Pick and Place/Feeders
1. SMT equipment original/imitation accessories sales: Fuji, Juki, Yamaha, Samsung, Panasonic, and other equipment suction nozzle, Feida and accessories, suction Rod, Suction nozzle Rod, sensor, cutter, belt, filter cotton, sensor, light module, sole
Parts & Supplies | Pick and Place/Feeders
937/5000 1. SMT equipment original/imitation accessories sales: Fuji, Juki, Yamaha, Samsung, Panasonic, and other equipment suction nozzle, Feida and accessories, suction Rod, Suction nozzle Rod, sensor, cutter, belt, filter cotton, sensor, light mo
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
Technical Library | 2019-05-24 09:22:59.0
There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points.
SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Career Center | Rochester, New York USA | Engineering
Job Description: Implements and analyzes manufacturing engineering plans and projects. Designs, develops and transfers manufacturing and engineering tools, strategies and systems. Develops manufacturing strategies for specific products and processes
Career Center | Williamsport, Pennsylvania USA | Engineering,Management
PRIMUS Technologies Corporation is an electronic manufacturing services (EMS) provider that produces highly reliable products for global government and commercial markets. Our company is an integrated lean enterprise that fully embodies the Six Sigma
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2167.html
: 20 Mar 2012 Location: Oxfordshire, UK Status: Offline Points: 576 Post Options Post Reply Quote jameshead Report Post Thanks(1) Quote Reply Posted: 26 Oct 2012 at 1:23am Ignoring solder paste aperture size and just looking at the copper pad alone I don't think that rounded rectangles are any better or worse then a normal rectangle for lead-free solder then leaded
| https://www.eptac.com/faqs/ask-helena-leo/page/7
? Read More Darkened SMT Capacitor or Resistor Terminations After LeadFree Soldering Reflow QUESTION Question: Lately some of our terminations on SMT caps and resistors look dark, almost purple, like they have been overheated during the reflow process in a lead free environment
