Industry Directory | Manufacturer
Hitechpcba is a wоrld-lеаding PCB Manufacturing & PCB Assembly company with more than 20 years experience in the electronics manufacturing industry. We focus on Circuit board fabrication, PCB assembly, electronic parts sourcing.
Industry Directory | Manufacturer
LCL Electronics is a UK-based contract electronics manufacturer (CEM), offering customers a full turnkey manufacturing solution, including prototype, pre-production and medium volumes of PCBs, product build and cable harnessing.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
Electronics Forum | Thu Sep 13 13:34:49 EDT 2001 | Dave G
Too much Convection Airflow in the Reflow Oven blowing parts around ? Moisture Contaminated Parts out gassing ? Board out gassing? Just some thoughts, DG
Electronics Forum | Fri Sep 28 09:30:07 EDT 2001 | kmorris
Just had a similar phenomenon 2 days ago. May relate to your issue --- or not. Like you, I did a once over looking for mechanical obstruction & couldn't find any. Ran a thermal profile on the offending PCB & all checked out. Looked in end of oven
Used SMT Equipment | Pick and Place/Feeders
Machine size: length 1500 * width 2000 * height 1500 (unit: mm) Machine structure: 3 groups of placement heads, different nozzles can be replaced automatically Machine specifications: standard version, front loading rack and tube load
Used SMT Equipment | Pick and Place/Feeders
Brand: FUJI Name: FUJI Scalble Placement Platform NXT Ii Module Width: 320mm Machine Dimensions: L：1295mm（M3 II×4, M6 II×2） Lntelligent Feeders: Support For 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, And 104 Mm Wide Tape Trays: Applicable Tr
Industry News | 2013-10-09 10:29:04.0
GPD Global will exhibit in Stand 214 in Hall A4 at the Productronica International Trade Fair. On display will be the versatile Max Series platform for dispensing of SMT glue, solder paste, conductive adhesives, underfill, UV, LED and more, configured with the volumetric PCD4H dispense pump and shown for the first time will be the NCM5000 simplified jetting pump.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Parts & Supplies | Pick and Place/Feeders
N610095856AB Panasonic POP feeder for CM402 , CM602 , NPM ,DT401 We provide CM602/CM402/NPM Feede, 4mm- 108mm , original new and used both in stock , delivery fast. Also we can provide the other spare parts of Panasonic machines , such
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Parts & Supplies | Pick and Place/Feeders
1. Special feature 1.1 Provide the best machine configuration for customers: NXTII is the only machine with a true modular concept. It is possible to freely install a combination of units such as a work head or a component supply unit and a transpo
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2021-12-16 01:52:32.0
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Webinar: The IPC Digital Twin Standard
Career Center | Suwanee, Georgia USA | Research and Development
Alpha Advanced Materials, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, d
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Package on Package (PoP
| https://pcbasupplies.com/custom-essemtec-nozzle-with-urethane-tip-for-cree-xbd-leds-2015-2475/
» SMT Custom Nozzles » Cree LED » Custom Essemtec Nozzle with Urethane Tip for Cree XBD leds [2015-2475] Custom Essemtec Nozzle with Urethane Tip for Cree XBD leds [2015-2475
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/led-assembly
. Flip chip LEDs need tight keep-out-zones and tiny dots dispensed for underfill . Many packages have multiple dies and the spacing of die is tight for optimum performance
