Industry Directory | Consultant / Service Provider / Manufacturer
Providing Belting/Sequencing Tape for Electronics Industry,bandoliering tape 6mm*3000m,thermal melting tape,active and passive component processing,axial taping and radial lead forming for capacitor,LED diode .sales2@chinatape.com
Featured Items: Single 8mm tape Abrasive Block for Feeder Table Double side tape (8mm) SMT magazine rack Siemens Valve Plunger SP6 DST-8MM-00 (4)splice tape Stencil wiping rolls Splice Clip SMT tools,SMD tapes
The FKN Systek K4000 motorized linear blade depanelizer is designed for high volume singulation of scored and skip scored Printed Circuit Boards. No programming necessary. (Switch select operating mode and speed) Singulate panels with components
Electronics Forum | Sun Jul 14 16:46:38 EDT 2019 | rob1
I'm working on A DEK 265 Horizon and I need to convert it to right to left. I have changed the conveyor direction in software, however, the board stop position appears to be from 0 to 255 and I need it stop on the left hand side of the centre referen
Electronics Forum | Fri Mar 16 17:50:45 EST 2001 | djarvis
Steve, I did this several years ago on a terribly designed board that left a lot of joints unsoldered after the wave. It works OK. This was a bog Irish board with nothing fancier than SOP packages. Glue was Amicon D125. Happy St. Patrick's Day everyo
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 1278, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Industry News | 2017-11-07 23:20:25.0
GPD Global offers a cost-effective, automated Conformal Coating System (SimpleCoat) with excellent repeatability for just under $40,000!!!
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Parts & Supplies | Component Packaging
1 KHY-M7151-00 EJECTOR,RESIN 1 1-1 KHY-M7151-01 EJECTOR,RESIN 1 (2008/12/26) MEY0069 OK 2 KHY-M4592-01 VAC SENSOR BRD ASSY 1 3 KHY-M71CA-00 COVER,VAC SENSOR 1 4 $TL10-01 JOINT 2 5 90563-23J060 SPACER 4 6 91312-03005 BOLT HEX.SOCKET HEAD 6
Parts & Supplies | Component Packaging
1 KHY-M7151-00 EJECTOR,RESIN 1 1-1 KHY-M7151-01 EJECTOR,RESIN 1 (2008/12/26) MEY0069 OK 2 KHY-M4592-01 VAC SENSOR BRD ASSY 1 3 KHY-M71CA-00 COVER,VAC SENSOR 1 4 $TL10-01 JOINT 2 5 90563-23J060 SPACER 4 6 91312-03005 BOLT HEX.SOCKET HEAD 6
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
http://www.gpd-global.com Conformal coating (SimpleCoat) demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system. The Spray Valve sprays HumiSeal 1B31 from a height of approximately 20 mm above the board. The Volumetr
03034070-02 Machine Table Identification 03034148-01 CALIBRATION UNIT VERSION SST23 03034337S01 HANDLE 03035323-01 Protection foil X-Trail 03035813-01 MOTOR 1FK7042 WITH GEAR WHEEL z=30 03035887-02 Trailing distributor 03036763-03 GAS-PRESSURE
Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Career Center | Derabassi, India | Maintenance,Management,Production,Quality Control,Sales/Marketing
PCB Assembly (SMT & PTH)--Process/Planning – Production – Maintenance/Troubleshooting – QA/QC
KingFei SMT Tech | http://www.smtspare-parts.com/sale-10597805-ke2020-pulley-left-side-for-e20317290a0-yb-pulley-bracket-r-asm.html
KE2020 Pulley Left Side for E20317290A0 YB Pulley Bracket R ASM Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
GPD Global | https://www.gpd-global.com/pdf/doc/Side-Mount-Loader-Unloader-Guide-24000600.pdf
Side-Mount Loader and Unloader User Guide Loader & Unloader User Guide Version 2.1 November 13, 2017 Part No: 24000600 for Side-Mount models
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