Electronics Forum | Tue Aug 03 10:11:11 EDT 2010 | keiths487
we have an HSP that keeps giving nozzle level (low) out of tolerance, we have performed lighting check, also this condition is only showing up on 3 or 4 heads...any input appreciated
Electronics Forum | Tue Aug 03 16:12:54 EDT 2010 | namruht
Just to get the simple stuff out of the way. Make sure that no one has changed the machine nozzle data to a different type. Then try actually changing the nozzle data and putting that type into the head. If this passes it will at least eliminate the
Industry News | 2021-09-02 06:10:22.0
MIRTEC announces the release of their comprehensive AI based Smart Factory Automation solution 'INTELLI-PRO'. This Technologically Advanced Software and Algorithm Package is specifically designed for the purpose of improving the performance and convenience of MIRTEC's complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.
Industry News | 2003-03-07 08:28:53.0
NPL now offers an on-site Lead-Free Health Check, where the issues brought to bear by lead-free are examined in the context of your company.
Technical Library | 2022-09-12 14:07:47.0
Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.
Technical Library | 2020-12-16 18:38:49.0
Fabrication of large structures using out-of-autoclave prepreg materials will lead to a great amount of savings in manufacturing costs. In the out-of-autoclave processing method, the presence of voids inside the laminate has been an issue due to the lack of high pressure during manufacturing. This study aims primarily to observe the moisture absorption response of composite samples containing different levels of void. By changing the vacuum level inside the bag during the manufacturing process, three different unidirectional laminates at three levels of void have been manufactured. After immersing the samples in warm water at 60°C for about one year, the moisture absorption level was monitored and then diffusion coefficients were calculated using Fick's law. Results show that the moisture absorption coefficient changes by %8 within the experimental range of void contents. The mechanical behaviour of these laminates has been studied at four different moisture levels by performing dynamic mechanical analysis (DMA) and short beam shear tests. Empirical results indicate that, in general, interlaminar shear strength and glass transition temperature decrease by moisture build-up inside the samples. DiBenedetto equation is proposed to make a correlation between the moisture content and glass transition temperature.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
ScanINSPECT BGA uses an intuitive process flow interface integrated with a high resolution, 2-D image-processing unit. This combination allows 100% inspection of ball placement on BGAs, in or out of trays (JDEC, etc.). This is Part 1: How to progr
Events Calendar | Thu Jun 13 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
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Qualification and Reliability of Microvias
Career Center | Palmdale, California USA | Management,Quality Control
Summary Plans, coordinates, and directs quality program designed to ensure quality control and quality assurance of the production of products consistent with established standards by performing the following duties personally or through subordinate
GPD Global | https://www.gpd-global.com/pdf/doc/Level-Detect-User-Guide-22200600.pdf
identify the level of material in a material syringe. The Level Detect is syringe size specific (5 cc, 10 cc, 30 cc, 55 cc, etc.). A Syringe Support - ready to receive a specific size syringe - is included. Figure 1
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/wafer-level-packaging-symposium-2022
. One of these advanced technologies is silicon-based wafer-level packaging, such as fan-out wafer-level packaging. As the semiconductor industry shifts focus to more than
