New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir
Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent
Industry News | 2003-05-21 08:13:48.0
Two half-day workshops on Thursday during SMTA
Industry News | 2016-02-10 15:50:38.0
SMTA is excited to announce the finalized program and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held April 12-14, 2016 at the Eastin Hotel in Penang, Malaysia.
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Parts & Supplies | Assembly Accessories
12MM Calibration Tape .12MM Calibration Tape 20 Inch Folding Bike Ravel Case 20 Inch Folding Bike ravel Case 4*4.1200pcs/bag M0604 8MM Calibration Tape .8MM Calibration Tape 90 degree drive set 90 degree drive set A2E BGA Rework Station Temp Con
Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi
The Call for Halogen-Free Electronic Assemblies News Forums Equipment Mart Company Directory Event's Calendar Career Center Advertising The Call for Halogen-Free Electronic Assemblies But exactly what is a "halogen-free" solder paste
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
BGA Assembly: Low-Silver Lead Free BGA Spheres into Tin-Lead & LF Assembly Processes Chrys Shea, Quyen Chu, and Ken Hubbard Free! 2009 Cleaning, Coating and Functional Climatic Reliability Ravi Parthasarathy, M.S.Chem.Eng. Free! 2008 Design for
| https://pcbasupplies.com/selective-soldering/ace-production-technologies/
Compare Quick view Details Count On Tools | sku: B-3 LF Nordson\ACE KISS Bullet Nozzles for Lead Free Solder - B-3 LF MSRP: Now: $190.00 Add to Cart Compare Quick view Details Count On Tools | sku: B-25 Nordson\ACE KISS Bullet Nozzles for Leaded Solder - B
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
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