Industry Directory: lga solder bridge (15)

BEST Inc.

BEST Inc.

Industry Directory | Consultant / Service Provider / Manufacturer / Standards Setting / Certification / Training Provider

BEST is a certified master IPC Training and Solder Certification center. We provide comprehensive courses for both Instructors and Operators including IPC-A-610, IPC J-STD-001, IPC-A-600, IPC/WHMA-A-620, and IPC 7711/7721 standard

Beau Tech

Beau Tech

Industry Directory | Manufacturer

A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.

New SMT Equipment: lga solder bridge (100)

Orange Sticks SH-83

Orange Sticks SH-83

New Equipment | Rework & Repair Equipment

Orange Sticks with double beveled ends, 7" x 5/32" (SH-83) The Beau Tech orange sticks are made of high quality non-resin wood which will not contaminate solder and component leads. Natural wood is among the best material that does not gen

Beau Tech

WDS-650 BGA Rework Station

WDS-650 BGA Rework Station

New Equipment | Rework & Repair Equipment

A lot of machine for an affordable price! The Model WDS-650 BGA Rework System has an 8mp High Resolution Split Vision Optical System for Removal, Placement, and Soldering of BGAs, CGA's, CSPs, QFPs, LGA's and Other SMDs.  A great mid level system wit

Precision PCB Services, Inc

Electronics Forum: lga solder bridge (925)

about solder bridge

Electronics Forum | Wed Apr 05 23:56:02 EDT 2000 | angela

Recently we have serious problem of our 0.5mm pitch QFP solder bridge. I check the viscosity of the Litton Kester paster. It's roumd about 700 is it too low. And do you have god solution about it? thanks alot

BGA solder bridge

Electronics Forum | Fri Feb 25 09:30:29 EST 2011 | kahrpr

Was the void on the same pad for the 5 failures or were they random

Used SMT Equipment: lga solder bridge (36)

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

Industry News: lga solder bridge (339)

Altium CAM System and Free ODB++ Viewer Bridge Gap Between PCB Design and Manufacture

Industry News | 2003-03-11 08:45:00.0

CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.

SMTnet

Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

SMTnet

Parts & Supplies: lga solder bridge (12)

Juki XMP card of KE2050

Juki XMP card of KE2050

Parts & Supplies | SMT Equipment

XMP card of KE2050 Professional maintenance JUKI SMT various circuit boards: JUKI CPU motherboard, SUB-CPU board, laser control board, servo drive card, X / Y / Z / Q-axis drive, 24V power supply card, head boards, image control card, I / O board

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

ASC International 3D SPI-7500 Vision CE

ASC International 3D SPI-7500 Vision CE

Parts & Supplies | SPI / Solder Paste Inspection

Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK

KingFei SMT Tech

Technical Library: lga solder bridge (18)

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Technical Library | 2023-01-17 17:58:36.0

Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.

Heller Industries Inc.

Solder Joint Encapsulant Adhesive - LGA High Reliability And Low Cost Assembly Solution

Technical Library | 2016-01-12 11:01:25.0

More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.

YINCAE Advanced Materials, LLC.

Videos: lga solder bridge (59)

PCB solder paste printer, solder paste printer , auto stencil printer ,pcb screen printer , Solder Paste Screen Printer

PCB solder paste printer, solder paste printer , auto stencil printer ,pcb screen printer , Solder Paste Screen Printer

Videos

https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main

ASCEN Technology

auto pcb screen printer, auto smt stencil printer , auto solder paste printer , stencil printing machine, PCB solder paste printer

auto pcb screen printer, auto smt stencil printer , auto solder paste printer , stencil printing machine, PCB solder paste printer

Videos

https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main

ASCEN Technology

Training Courses: lga solder bridge (7)

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: lga solder bridge (5)

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures

Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures

Surface Mount Technology Association (SMTA)

SMTA International 2020 Conference & Exhibition

Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA

SMTA International 2020 Conference & Exhibition

Surface Mount Technology Association (SMTA)

Career Center - Jobs: lga solder bridge (2)

Assembler 2 – IPC 610 – 1st Shift

Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production

Job Title: Assembler 2 – IPC 610 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Use microscope to verify

Lockheed Martin Corporation

Senior Assembler

Career Center | Oldsmar, Florida USA | Maintenance,Production

Job Description: • Uses microscope to verify correct part placement and orientation, manually align parts before soldering and perform post re-flow inspection and touch-up. • Able to identify and touch up poor wetted solder joints, solder voids / i

intiGrow

Career Center - Resumes: lga solder bridge (7)

Staff Process Engineer

Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control

15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience

Debug engineer or bga rework engineer

Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support

tel u later

Express Newsletter: lga solder bridge (979)

Partner Websites: lga solder bridge (286)

672219 - Center Rack Bridge

Heller Industries Inc. | https://hellerindustries.com/parts/672219/

672219 - Center Rack Bridge Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

Bridge Type Image measuring machine-PCB magazine loader,PCB turn conveyor,pcb conformal coating mach

ASCEN Technology | https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/499.html

Bridge Type Image measuring machine-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB depaneling machine,pcb buffer conveyor from ASCEN technology Welcome to visit ASCEN | | | | | | | Cart

ASCEN Technology


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