Industry Directory: lifted bga pin (17)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..

Shenzhen Yinhe Electronecs CO EC Ltd

Industry Directory | Manufacturer

We are specializing in test probes,BGA double-ended probes,coaxial probes,Pogo pin

New SMT Equipment: lifted bga pin (41)

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

New Equipment | Software

ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc.  ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat

UNISOFT Corporation

Electronics Forum: lifted bga pin (393)

LED lifted soldering defect

Electronics Forum | Thu Dec 05 05:39:05 EST 2019 | oxygensmd

I know your application isn't BGA but the data sheet also mention about the peak temperature - 235 Celsius. For the LEDs you can reach higher temperature and I recommend to reach 225-235 Celsius. You will get significantly better results because the

underfilling of bga

Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo

Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar

Used SMT Equipment: lifted bga pin (40)

Yamaha YV100 Ⅱ YAMAHAmulti-functional chip mounter

Yamaha YV100 Ⅱ YAMAHAmulti-functional chip mounter

Used SMT Equipment | Pick and Place/Feeders

Product number: YV100 Ⅱ Products in detail YAMAHA multi-function chip mounter YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 10000(grain per hour) Japan's YAMAHA YV100II SMT machine: The patch speed: 0

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100 Ⅱ YAMAHAmulti-functional

Yamaha YV100 Ⅱ YAMAHAmulti-functional

Used SMT Equipment | Chipshooters / Chip Mounters

Product name: YV100 Ⅱ YAMAHAmulti-functional chip mounter Product number: YV100 Ⅱ Products in detail YAMAHA multi-function chip mounter YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 100

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: lifted bga pin (178)

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at APEX 2022

Industry News | 2021-12-21 14:45:26.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1122 at the 2022 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 25-27, 2022, at the San Diego Convention Center.

MIRTEC Corp

MIRTEC to Offer Live Remote Demo of the GENESYS-PIN 3D Pin Inspection System at SMTconnect

Industry News | 2022-04-13 10:22:58.0

MIRTEC will premier its line of 3D AOI and SPI Inspection Systems Hall 4A, Stand 128 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg.

MIRTEC Corp

Parts & Supplies: lifted bga pin (359)

DEK 217328

DEK 217328

Parts & Supplies | Pick and Place/Feeders

DRIVE BELT^RAIL WIDTH DEK 185938 DRIVE BELT^TABLE LIFT DEK 185934 DEK Q-250D COVERS SYSTEM SWITCH LOOM BOM DEK DEK 163512 BELT, TIMING (16T10/1970), PAIR DEK 129250 BELT, TIMING (16T10/2350) DEK 129268 PRINT CARRIAGE MOTOR ( TXT ) DEK 13312

Qinyi Electronics Co.,Ltd

DEK 217328

DEK 217328

Parts & Supplies | Pick and Place/Feeders

DRIVE BELT^RAIL WIDTH DEK 185938 DRIVE BELT^TABLE LIFT DEK 185934 DEK Q-250D COVERS SYSTEM SWITCH LOOM BOM DEK DEK 163512 BELT, TIMING (16T10/1970), PAIR DEK 129250 BELT, TIMING (16T10/2350) DEK 129268 PRINT CARRIAGE MOTOR ( TXT ) DEK 13312

Qinyi Electronics Co.,Ltd

Technical Library: lifted bga pin (3)

Basics of Ball Grid Arrays (BGAs)

Technical Library | 2015-02-05 23:23:40.0

Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today's high pin count, high frequency integrated circuits. However, that same pin density and unique interface create a challenge unique unto themselves. These challenges need to be faced head on since the ball grid array (BGA) is prevalent in modern PCBs. While there are entire textbooks that cover the topic of BGAs, their use and fanout techniques, the quick overview provided here offers an engineer a good starting point for improving BGA designs.

Advanced Assembly, LLC.

Interconnect Reliability Correlation with System Design and Transportation Stress

Technical Library | 2020-10-18 19:35:05.0

Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping condition and user environment. Plating thickness of compliant pin and damping mechanism of electronic system design are key successful factors for this purpose. In additional transportation and material handling process of a computer server system will be affected by shock under certain conditions. Many accessories devices in the server computer system tend to become loose resulting in poor contact or solder intermittent interconnect problems due to the shock load from the transportation and material handling processes.

MiTAC International Corporation

Videos: lifted bga pin (81)

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

Videos

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Siemens PL EA 03012564-03

Videos

03027548-01 Guide, left-hand side 03027563-01 Loctite 7063 CLEANER 03027570-03 HOTLINK CARD CPCI A14 K-01 03027644-01 HOLDER FOR CABLE INTERFACE 03027646-02 JUMPER 120 Ohm SUD-D PIN 03027905-01 Adapter cable MTC2 CAN bus 03028249-02 Pneumatic S

Qinyi Electronics Co.,Ltd

Career Center - Jobs: lifted bga pin (4)

Advanced Manufacturing Technology Engineer

Career Center | Space Coast, Florida USA | Engineering,Research and Development

Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit

Priority Search

Senior Advanced Packaging Engineer

Career Center | Melbourne, Florida USA | Engineering

Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi

Harris Corporation

Career Center - Resumes: lifted bga pin (3)

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

Staff Process Engineer

Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control

15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience

Express Newsletter: lifted bga pin (514)

Partner Websites: lifted bga pin (1696)

BGA Rework Nozzles for Shuttle Star BGA Rework Stations – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-nozzles-for-shuttle-star-bga-rework-stations

BGA Rework Nozzles for Shuttle Star BGA Rework Stations – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc

Precision PCB Services, Inc


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High Throughput Reflow Oven
SMTAI 2024 - SMTA International

Training online, at your facility, or at one of our worldwide training centers"
Online Equipment Auction Jabil Monterrey MX Aug 19, 2024

World's Best Reflow Oven Customizable for Unique Applications
PCB Handling with CE

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...