Industry Directory: lifted pads peel strength (1)

Werlchem LLC

Industry Directory | Manufacturer

Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, g

New SMT Equipment: lifted pads peel strength (2)

PCB Epoxy Repair Kit

PCB Epoxy Repair Kit

New Equipment | Rework & Repair Equipment

The BEST PCB Epoxy Repair Kit can be used to repair lifted pads and traces as well as build up and repair edge corner damage to PCBs or repair solder mask which has been damaged or removed. By adding colorants a pcb color epoxy kit can be made up cus

BEST Inc.

Epoxy Repair Kit

Epoxy Repair Kit

New Equipment | Rework & Repair Equipment

The BEST Epoxy Repair Kit can be used to fix damaged solder mask, damaged PCB laminate material as well as repair lifted pads and traces. 3rd party testing has shown by using the BEST 2-part epoxy, the bond strength of repair traces, pads, and lands

soldertools.net

Electronics Forum: lifted pads peel strength (21)

Solder joint strength

Electronics Forum | Tue Mar 22 07:39:05 EST 2005 | davef

There is no standard. This is a relative test. If you wish to do tests of this kind, we suggest to pay attention to the following points: * Shear strength of soft solder depends on the deformation speed applied. The faster the material is deformed t

Re: Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F

| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl

Industry News: lifted pads peel strength (5)

IPC Honors Best Papers at IPC APEX EXPO� 2009

Industry News | 2009-04-15 23:01:13.0

BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.

Association Connecting Electronics Industries (IPC)

Henkel Product Development Expertise Rewarded at APEX

Industry News | 2010-04-16 01:50:52.0

Building on a rich history of industry honors and product accolades, Henkel Corporation was once again recognized for its innovation initiatives at the recent APEX event in Las Vegas, Nevada. Two of the company’s most recent product advances, Loctite PowerstrateXtreme Printable (PSX-P) and Hysol ECCOBOND CA3556HF, were at the top of the leaderboard for two well-established honors programs.

Henkel Electronic Materials

Parts & Supplies: lifted pads peel strength (6)

Assembleon SWITCH, T212-61194-033N 5322 280 40345

Assembleon SWITCH, T212-61194-033N 5322 280 40345

Parts & Supplies | Assembly Accessories

LAS Y Motor Belt Belt Y-Motor 330 mm 5322 358 31302 .. 5322 358 31302 Sensor ..5322 132 00056 TRANSMITTING SENSOR 8MM FOR FEEDER ..5322 132 00103 Transmitting Sensor 12mm ..5322 132 00105 Receiving Sensor 12mm ..5322 132 00106 Transmitting Senso

Qinyi Electronics Co.,Ltd

Assembleon SWITCH, PHOTO ELECTRIC 5322 209 32294

Assembleon SWITCH, PHOTO ELECTRIC 5322 209 32294

Parts & Supplies | Assembly Accessories

LAS Y Motor Belt Belt Y-Motor 330 mm 5322 358 31302 .. 5322 358 31302 Sensor ..5322 132 00056 TRANSMITTING SENSOR 8MM FOR FEEDER ..5322 132 00103 Transmitting Sensor 12mm ..5322 132 00105 Receiving Sensor 12mm ..5322 132 00106 Transmitting Senso

Qinyi Electronics Co.,Ltd

Technical Library: lifted pads peel strength (1)

Study on Solder Joint Reliability of Fine Pitch CSP

Technical Library | 2015-12-31 15:19:28.0

Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.

Flex (Flextronics International)

Videos: lifted pads peel strength (8)

universal gold plus feeder , feeder tranfer cart , feeder bank assy

universal gold plus feeder , feeder tranfer cart , feeder bank assy

Videos

we have many hitachi equipment and hitachi feeders to sell . if you want to know more , please contact us tina@smtfeeders.cn

Shenzhen Zhi Honglai Trading Co.,Ltd

univeral gold plus feeders

univeral gold plus feeders

Videos

we have many hitachi equipment and hitachi feeders to sell . if you want to know more , please contact us tina@smtfeeders.cn

Shenzhen Zhi Honglai Trading Co.,Ltd

Express Newsletter: lifted pads peel strength (269)

Partner Websites: lifted pads peel strength (10)


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