Industry Directory | Manufacturer
Production and distribution of metal jointing materials for electronics (solder, flux, brazing alloys, etc) Sales of nonferrous metal Export-import business
Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
New Equipment | Solder Materials
In August 2007, Nihon Superior started simultaneous worldwide sales of SN100C (030) “eCore,” a resin flux cored, lead-free solder product, which contains the newly developed flux that enables the product to display the distinctive features of SN100C
New Equipment | Solder Materials
We have a wide variety of flux-Cored solder, a mix of metal alloy, flux and other elements, that we have put together to match every type of application. This formula is designed so that the incidence of bridging is rare; likew
Electronics Forum | Tue Apr 29 07:12:49 EDT 2003 | Glen barden
Sn/Cu/Ni is introducted to me in wavesoldering lead free process. Around in our industry, we have a plenty of info. about SAC but not on this alloy. The distributor showed me some information about this alloy including less dross, more shiny /smoot
Electronics Forum | Wed May 11 19:34:42 EDT 2005 | Tom B
You may want to check out Nihon Superior. Nihon licensed their Alloy to Aim for US production Late last month! The alloy uses nickel and the solder joints look amazing for "lead-free" they rival tin-lead in appearance. Other boasts is that you can
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our Orbotech Symbion S36 AOI For Sale. The system is Year 2006.... Excellent condition !!! Complete with all accessories and manuals. Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI p
Used SMT Equipment | Soldering - Reflow
Configuration ● Water cooled for superior cooling performance (includes chiller) ● edge/mesh conveyance ● left to right transfer ● flux management system ● Pure Forced Convection Heating ● Advanced Windows Operating system with Data Logging.
Industry News | 2019-08-21 16:55:59.0
MIRTEC will exhibit in Booth #305 at SMTA International. MIRTEC will showcase the latest advancements in their award-winning 3D AOI and SPI Systems at the two-day event.
Industry News | 2019-09-23 16:01:19.0
MIRTEC will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The MIRTEC team will showcase the all new MV-6 OMNI 3D AOI Machine and award-winning MS-11e 3D SPI Machine.
Technical Library | 2019-06-20 00:09:49.0
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni.
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| https://pcbasupplies.com/sn100c-lead-free-bar-solder/
by Nihon Superior Sha Co., Ltd. and its licensees*, NT100Ge is a high-quality, low-cost alternative to silver-bearing solder. The eutectic tin-copper-nickel alloy creates a shiny, smooth, robust interconnect for a wide range of electronics assembly requirements
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